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BD3504FVM-FTR

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17
BD3504FVM,BD3500FVM,BD3501FVM,BD3502FVM
Technical Note
10/16
www.rohm.com
2010.05 - Rev.A
© 2010 ROHM Co., Ltd. All rights reserved.
●Application circuit
C3
C2
Ven
C4
C5
VIN
C1
Vcc
+
1
2
3
4
8
7
6
5
VIN
R1’
R2’
C3
Ven
C4
C1
Vcc
+
1
2
3
4
8
7
6
5
C2
R1
R2
●Directions for pattern layout of PCB
・Because a VIN input capacitor causes impedance to drop, mount it as close to the VIN terminal as possible and use thick
wiring patterns. In the event that it causes the wire to come in contact with the inner-layer ground plane, use a plurality of
through holes.
・Because the NRCS terminal is analog I/O, take care to noise. In particular, high-frequency noise of GND may cause IC
maloperation through capacitors. It is recommended to connect GND of NRCS capacitor to IC GND terminal at one
point.
・The VFB terminal is an output voltage sense line. Effects of wiring impedance can be ignored by sensing the output
voltage from the load side, but increased sense wiring causes VFB to be susceptible to noise, to which care must be
taken.
・Because the GND terminal is GND to be used in analog circuit inside BD3501/02/04FVM, connect it at one point to
inner-layer GND of substrate by as short pattern as possible. Arrange a bypass capacitor across VCC and GND as close
as possible so that a loop can be minimized.
・The G terminal is a terminal for gate drive. If long wiring is inevitable, increase the pattern width and lower impedance.
・Heat generated in the output transistor can be calculated by:
(VIN - VOUT) × Io(Max)
Design heat generation not to exceed the guarantee temperature of transistor.
・Connect the output capacitor with thick short wiring so that the impedance is lowered. Connect capacitor GND to
inner-layer GND plane by a plurality of through holes.
BD3504FVM,BD3500FVM,BD3501FVM,BD3502FVM
Technical Note
11/16
www.rohm.com
2010.05 - Rev.A
© 2010 ROHM Co., Ltd. All rights reserved.
Silk Screen
TOP Laye
r
Bottom Laye
r
Silk Screen
TOP Layer
Bottom Layer
BD3504FVM
G
EN
VCC
NRCS
VD
VS
GND
VCC
S1
3
6
5
7
U1
VFB
GND
VTTS
1
C1
4
2
VCC
8 VIN
VOUT
C2
C3
C4
U2
R2’
R1’
R2
R1
●Evaluation Board (BD3500/01/02FVM)
■
■BD350XFVM Evaluation Board Circuit
■
■BD350XFVM Evaluation Board Application Components
Part No Value Company Parts Name
U1 - ROHM BD3500/01/02FVM
U2 NMOS ROHM RTW060N03
C1 1µF MURATA GRM18 series
C2 0.01µF MURATA GRM18 series
Part No Value Company Parts Name
C3 0.01µF MURATA GRM18 series
C4 10µF MURATA GRM21 series
C5 220µF SANYO,etc 2R5TPE220MF
■
■
BD350XFVM Evaluation Board Layout
●Evaluation Board (BD3504FVM)
■
■BD3504FVM Evaluation Board Circuit
■
■BD3504FVM Evaluation Board Application Components
Part No Value Company Parts Name
U1 - ROHM BD35304FVM
U2 NMOS ROHM RTW060N03
R1 3.9K ROHM MCR03EZPF3901
R1’ 3.3K ROHM MCR03EZPF3301
R2 3.9K ROHM MCR03EZPF3901
Part No Value Company Parts Name
R2’ 3.3K ROHM MCR03EZPF3301
C1 1µF MURATA GRM18 series
C2 0.01µF MURATA GRM18 series
C3 10µF MURATA GRM21 series
C4 220µF SANYO,etc 2R5TPE220MF
■
■
BD3504FVM Evaluation Board Layout
BD350XFVM
G
EN
VCC
NRCS
VIN
VFB
GND
VCC
S1
8
6
7
U1
1
C1
4
2
VCC
VIN
VOUT
C3
C4
C5
U2
SCP
3
C2
5
BD3504FVM,BD3500FVM,BD3501FVM,BD3502FVM
Technical Note
12/16
www.rohm.com
2010.05 - Rev.A
© 2010 ROHM Co., Ltd. All rights reserved.
●I/O EQUIVALENCE CIRCUIT
◎BD3500FVM/BD3501FVM/BD3502FVM
◎BD3504FVM
VI
Vcc
Vcc Vcc
SCP
GATE
Vcc Vcc
EN
VFB
Vcc Vcc
NRCS
Vcc
Vcc
VD
EN
GATE
Vcc Vcc
VFB
Vcc
NRCS
Vcc Vcc Vcc
Vs
Vcc
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17

BD3504FVM-FTR

Mfr. #:
Buy BD3504FVM-FTR
Manufacturer:
Description:
LDO Voltage Controllers 4.5-5.5V 1ch FET LDO Control
Lifecycle:
New from this manufacturer.
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