TSM4N90CZ C0G

TSM4N90
Taiwan Semiconductor
Document Number: DS_P0000109 1 Version: C15
N-Channel Power MOSFET
900V, 4A, 4.0
FEATURES
Low R
DS(ON)
4 (Max.)
Low gate charge typical @ 25nC (Typ.)
Improve dV/dt capability
KEY PERFORMANCE PARAMETERS
PARAMETER VALUE UNIT
V
DS
900 V
R
DS(on)
(max) 4
Q
g
25 nC
APPLICATION
High efficiency switch mode power Supply
Lighting
TO
-
220
ITO
-
220
Notes: Moisture sensitivity level: level 3. Per J-STD-020
ABSOLUTE
AXIMUM RATINGS
(T
A
= 25°C unless otherwise noted)
PARAMETER SYMBOL TO-220
ITO-220
UNIT
Drain-Source Voltage V
DS
900 V
Gate-Source Voltage V
GS
±30 V
Continuous Drain Current
(Note 1)
T
C
= 25°C
I
D
4 4*
A
T
C
= 100°C 2.2 2.2*
Pulsed Drain Current
(Note 2)
I
DM
16 16 * A
Total Power Dissipation @ T
C
= 25°C P
DTOT
123 38.7 W
Single Pulsed Avalanche Energy
(Note 3)
E
AS
474 mJ
Single Pulsed Avalanche Current
(Note 3)
I
AS
4 A
Repetitive Avalanche Energy
(Note 2)
E
AR
12.3 mJ
Peak Diode Recovery
(Note 7)
dV/dt 4.5 V
Operating Junction and Storage Temperature Range T
J
, T
STG
- 55 to +150 °C
THERMAL PERFORMANCE
PARAMETER SYMBOL TO-220
ITO-220
UNIT
Junction to Case Thermal Resistance R
ӨJC
1.01 3.23 °C/W
Junction to Ambient Thermal Resistance R
ӨJA
62.5 °C/W
Notes: R
ӨJA
is the sum of the junction-to-case and case-to-ambient thermal resistances. The case thermal reference is defined
at the solder mounting surface of the drain pins. R
ӨJA
is guaranteed by design while R
ӨCA
is determined by the user’s board
design. R
ӨJA
shown below for single device operation on FR-4 PCB in still air.
TSM4N90
Taiwan Semiconductor
Document Number: DS_P0000109 2 Version: C15
ELECTRICAL SPECIFICATIONS
(T
A
= 25°C unless otherwise noted)
PARAMETER CONDITIONS SYMBOL
MIN TYP MAX
UNIT
Static
(Note 4)
Drain-Source Breakdown Voltage V
GS
= 0V, I
D
= 250µA BV
DSS
900 -- --
V
Gate Threshold Voltage V
DS
= V
GS
, I
D
= 250µA V
GS(TH)
2 -- 4
V
Gate Body Leakage V
GS
= ±30V, V
DS
= 0V I
GSS
-- -- ±100
nA
Zero Gate Voltage Drain Current V
DS
= 900V, V
GS
= 0V I
DSS
-- -- 10
µA
Drain-Source On-State Resistance
V
GS
= 10V, I
D
= 2.0A
R
DS(on)
-- 3.2 4.0
Forward Transconductance
V
DS
= 30V, I
D
= 2.0A
g
fs
-- 6 -- S
Dynamic
(Note 5)
Total Gate Charge
V
DS
= 720V, I
D
= 4.0A,
V
GS
= 10V
Q
g
-- 25 --
nC
Gate-Source Charge Q
gs
-- 4.8 --
Gate-Drain Charge Q
gd
-- 10.2 --
Input Capacitance
V
DS
= 25V, V
GS
= 0V,
f = 1.0MHz
C
iss
-- 955 --
pF
Output Capacitance C
oss
-- 80 --
Gate Resistance F = 1MHz, open drain R
g
-- -- 4
Switching
(Note 6)
Turn-On Delay Time
V
DD
= 450V,
R
GEN
= 25,
I
D
= 4.0A, V
GS
= 10V,
t
d(on)
-- 49 --
ns
Turn-On Rise Time t
r
-- 38 --
Turn-Off Delay Time t
d(off)
-- 146 --
Turn-Off Fall Time t
f
-- 50 --
Source-Drain Diode
(Note 4)
Forward On Voltage
I
S
= 4.0A, V
GS
= 0V V
SD
-- -- 1.5 V
Reverse Recovery Time
V
GS
= 0V, I
S
= 4A
dI
F
/dt = 100A/µs
t
rr
-- 487 -- ns
Reverse Recovery Charge
Q
rr
-- 2.8 -- µC
Notes:
1. Current limited by package.
2. Pulse width limited by the maximum junction temperature.
3. L = 56mH, I
AS
= 4.0A, V
DD
= 50V, R
G
= 25, Starting T
J
= 25
o
C.
4. Pulse test: PW 300µs, duty cycle 2%.
5. For DESIGN AID ONLY, not subject to production testing.
6. Switching time is essentially independent of operating temperature.
7. I
SD
4A, dI/dt 200A/uS, V
DD
BV
DSS
, Starting T
J
= 25
o
C.
TSM4N90
Taiwan Semiconductor
Document Number: DS_P0000109 3 Version: C15
ORDERING INFORMATION
PART NO.
PACKAGE
PACKING
TSM4N90CZ C0G TO-220 50pcs / Tube
TSM4N90CI C0G ITO-220 50pcs / Tube
Note:
1. Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC
2. Halogen-free according to IEC 61249-2-21 definition

TSM4N90CZ C0G

Mfr. #:
Manufacturer:
Taiwan Semiconductor
Description:
MOSFET 900V 4Amp N channel Mosfet
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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