HMPP-389x Series
MiniPak Surface Mount RF PIN Switch Diodes
Data Sheet
Description/Applications
These ultra-miniature products represent the blending of
Avago Technologies’ proven semiconductor and the latest
in leadless packaging technology.
The HMPP-389x series is optimized for switching applications
where low resistance at low current and low capacitance
are required. The MiniPak package oers reduced parasitics
when compared to conventional leaded diodes, and lower
thermal resistance.
Low junction capacitance of the PIN diode chip, combined
with ultra low package parasitics, mean that these prod-
ucts may be used at frequencies which are higher than
the upper limit for conventional PIN diodes.
Note that Avago’s manufacturing techniques assure that
dice packaged in pairs are taken from adjacent sites on
the wafer, assuring the highest degree of match.
The HMPP-389T low inductance wide band shunt switch
is well suited for applications up to 6 GHz.
Minipak 1412 is a ceramic based package, while Minipak
QFN is a leadframe based package.
Package Lead Code Identication (Top View)
Features
• Surface mount MiniPak package
• Better thermal conductivity for higher power dissipa-
tion
• Single and dual versions
• Matched diodes for consistent performance
• Low capacitance
• Low resistance at low current
• Low FIT (Failure in Time) rate*
• Six-sigma quality level
* For more information, see the Surface Mount Schottky Reliability
Data Sheet.
Pin Connections and Package Marking
Notes:
1. Package marking provides orientation and
identication.
2. See “Electrical Specications” for appropri-
ate package marking.
3
2
Product code Date code
4
AA
1
Single
3
2
4
1
#0
Anti-parallel
3
2
4
1
#2
Parallel
3
2
4
1
#5
(Minipak 1412) (Minipak 1412) (Minipak 1412)
Shunt Switch
3
2
4
1
T
Anode Cathode
Cathode Anode
