NSIC2030BT3G Datasheet NSIC2030BT3G | P7-P9

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Higher Current LED Strings

Two or more fixed current CCRs can be connected in

parallel. The current through them is additive (Figure 11).

Figure 11.

Other Currents

The adjustable CCR can be placed in parallel with any

other CCR to obtain a desired current. The adjustable CCR

provides the ability to adjust the current as LED efficiency

increases to obtain the same light output (Figure 12).

Figure 12.

Dimming using PWM

The dimming of an LED string can be easily achieved by

placing a BJT in series with the CCR (Figure 13).

Figure 13.

The method of pulsing the current through the LEDs is

known as Pulse Width Modulation (PWM) and has become

the preferred method of changing the light level. LEDs being

a silicon device, turn on and off rapidly in response to the

current through them being turned on and off. The switching

time is in the order of 100 nanoseconds, this equates to a

maximum frequency of 10 Mhz, and applications will

typically operate from a 100 Hz to 100 kHz. Below 100 Hz

the human eye will detect a flicker from the light emitted

from the LEDs. Between 500 Hz and 20 kHz the circuit may

generate audible sound. Dimming is achieved by turning the

LEDs on and off for a portion of a single cycle. This on/off

cycle is called the Duty cycle (D) and is expressed by the

amount of time the LEDs are on (Ton) divided by the total

time of an on/off cycle (Ts) (Figure 14).

Figure 14.

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The current through the LEDs is constant during the period

they are turned on resulting in the light being consistent with

no shift in chromaticity (color). The brightness is in proportion

to the percentage of time that the LEDs are turned on.

Figure 15 is a typical response of Luminance vs Duty Cycle.

Figure 15. Luminous Emmitance vs. Duty Cycle

DUTY CYCLE (%)

100908070605040

1000

3000

ILLUMINANCE (lx)

2000

4000

6000

20100

5000

Lux

Linear

Reducing EMI

Designers creating circuits switching medium to high

currents need to be concerned about Electromagnetic

Interference (EMI). The LEDs and the CCR switch

extremely fast, less than 100 nanoseconds. To help eliminate

EMI, a capacitor can be added to the circuit across R2.

(Figure 13) This will cause the slope on the rising and falling

edge on the current through the circuit to be extended. The

slope of the CCR on/off current can be controlled by the

values of R1 and C1.

The selected delay / slope will impact the frequency that

is selected to operate the dimming circuit. The longer the

delay, the lower the frequency will be. The delay time should

not be less than a 10:1 ratio of the minimum on time. The

frequency is also impacted by the resolution and dimming

steps that are required. With a delay of 1.5 microseconds on

the rise and the fall edges, the minimum on time would be

30 microseconds. If the design called for a resolution of 100

dimming steps, then a total duty cycle time (Ts) of 3

milliseconds or a frequency of 333 Hz will be required.

Thermal Considerations

As power in the CCR increases, it might become

necessary to provide some thermal relief. The maximum

power dissipation supported by the device is dependent

upon board design and layout. Mounting pad configuration

on the PCB, the board material, and the ambient temperature

affect the rate of junction temperature rise for the part. When

the device has good thermal conductivity through the PCB,

the junction temperature will be relatively low with high

power applications. The maximum dissipation the device

can handle is given by:

D(MAX)

J(MAX)

* T

qJA

Referring to the thermal table on page 2 the appropriate

for the circuit board can be selected.

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PACKAGE DIMENSIONS

SMB

CASE 403A−03

ISSUE H

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.

2.261

0.089

2.743

0.108

2.159

0.085

inches

SCALE 8:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIM

MIN NOM MAX MIN

MILLIMETERS

1.90 2.20 2.28 0.075

INCHES

A1 0.05 0.10 0.19 0.002

b 1.96 2.03 2.20 0.077

c 0.15 0.23 0.31 0.006

D 3.30 3.56 3.95 0.130

E 4.06 4.32 4.60 0.160

L 0.76 1.02 1.60 0.030

0.087 0.090

0.004 0.007

0.080 0.087

0.009 0.012

0.140 0.156

0.170 0.181

0.040 0.063

NOM MAX

5.21 5.44 5.60 0.205 0.214 0.220

0.51 REF

0.020 REF

POLARITY INDICATOR

OPTIONAL AS NEEDED

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