Reflow soldering
Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D
Profile feature Sn-Pb eutectic assembly Pb-free assembly
Preheat and soak
- Temperature min T
smin
100 °C 150 °C
- Temperature max T
smax
150 °C 200 °C
- Time t
smin
to t
smax
60 ... 120 s 60 ... 180 s
Average ramp-up rate T
smax
to T
p
3 °C/ s max. 3 °C/ s max.
Liquidous temperature T
L
183 °C 217 °C
Time at liquidous t
L
60 ... 150 s 60 ... 150 s
Peak package body temperature T
p
1)
220 °C ... 235 °C
2)
245 °C ... 260 °C
2)
Time (t
P
)
3)
within 5 °C of specified
classification temperature (T
c
)
20 s
3)
30 s
3)
Average ramp-down rate T
p
to T
smax
6 °C/ s max. 6 °C/ s max.
Time 25 °C to peak temperature max. 6 minutes max. 8 minutes
1) Tolerance for peak profile temperature (T
P
) is defined as a supplier minimum and a user maximum.
2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.
3) Tolerance for time at peak profile temperature (t
P
) is defined as a supplier minimum and a user maximum.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Number of reflow cycles: 3
Temperature measurement B57561G1
Glass-encapsulated sensors with insulation G1561
Page 14 of 24Please read Cautions and warnings and
Important notes at the end of this document.
