NP90N04MUG-S18-AY

Data Sheet D18665EJ2V0DS
5
NP90N04MUG
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
CHANNEL TEMPERATURE
CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE
RDS(on) - Drain to Source On-state Resistance - mΩ
0
2
4
6
-75 -25 25 75 125 175 225
Pulsed
V
GS
= 10 V
I
D
= 45 A
T
ch - Channel Temperature - °C
Ciss, Coss, Crss - Capacitance - pF
100
1000
10000
1
00000
0.01 0.1 1 10 100
V
GS
= 0 V
f = 1 MHz
C
iss
C
oss
C
rss
V
DS - Drain to Source Voltage - V
SWITCHING CHARACTERISTICS
DYNAMIC INPUT/OUTPUT CHARACTERISTICS
td(on), tr, td(off), tf - Switching Time - ns
1
10
100
1000
0.1 1 10 100
t
r
t
d(off)
t
d(on)
t
f
V
DD
= 20 V
V
GS
= 10 V
R
G
= 0
Ω
I
D - Drain Current - A
VDS - Drain to Source Voltage - V
0
5
10
15
20
25
30
35
40
0 50 100 150 200
0
3
6
9
12
V
DS
I
D
= 90 A
V
GS
V
DD
= 32 V
20 V
8 V
QG - Gate Charge - nC
VGS - Gate to Source Voltage - V
SOURCE TO DRAIN DIODE
FORWARD VOLTAGE
REVERSE RECOVERY TIME vs.
DIODE FORWARD CURRENT
IF - Diode Forward Current - A
0.1
1
10
100
1000
0 0.5 1 1.5
V
GS
= 10 V 0 V
Pulsed
V
F(S-D) - Source to Drain Voltage - V
trr - Reverse Recovery Time - ns
1
10
100
1000
0.1 1 10 100
di/dt = 100 A/
μ
s
V
GS
= 0 V
I
F - Diode Forward Current - A
Data Sheet D18665EJ2V0DS
6
NP90N04MUG
PACKAGE DRAWING (Unit: mm)
TO-220 (MP-25K)
EQUIVALENT CIRCUIT
Source
Body
Diode
Gate
Drain
Remark Strong electric field, when exposed to this device, can cause destruction of the gate oxide and ultimately
degrade the device operation. Steps must be taken to stop generation of static electricity as much as
possible, and quickly dissipate it once, when it has occurred.
Data Sheet D18665EJ2V0DS
7
NP90N04MUG
MARKING INFORMATION
90N04
Lot code
NEC
UG
Pb-free plating marking
Abbreviation of part number
RECOMMENDED SOLDERING CONDITIONS
The NP90N04MUG should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
sales representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Soldering Method Soldering Conditions
Recommended
Condition Symbol
Wave soldering
MP-25K
Maximum temperature (Solder temperature): 260°C or below
Time: 10 seconds or less
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
THDWS
Partial heating
MP-25K
Maximum temperature (Pin temperature): 350°C or below
Time (per side of the device): 3 seconds or less
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
P350
Caution Do not use different soldering methods together (except for partial heating).

NP90N04MUG-S18-AY

Mfr. #:
Manufacturer:
Description:
MOSFET N-CH 40V 90A TO-263
Lifecycle:
New from this manufacturer.
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