APPLICATION HINTS:
For 14.5V supply and 8
Ω
speaker application, its
maximum power dissipation is about 1.8W.
Assumming that max ambient temperature is
70
°
C, the required thermal resistance of the de-
vice mounted on the PCB with a dissipating area
must be equal to: (150 - 70)/1.8 = 44.4
°
C/W.
Junction to pin thermal resistance of the package
is about 15
°
C/W. That means external heat sink
of about 30
°
C/W is required.
Cu ground plane of PCB can be used as heat dis-
sipating means.
IN
SVR
P-GND
V
S
C4
100µF
V
S
=14.5V
C5 470µF
OUT
8Ω
C1 0.1µF
C3
47µF
IN
D98AU828
STAND-BY
4
3
9 to 16
2
1
S-GND
6
Figure 1. Application Circuit
THERMAL DATA
Symbol Parameter Value Unit
R
th j-amb
Thermal Resistance Junction to ambient 70 °C/W
R
th j-case
Thermal Resistance Junction to case 15 °C/W
ELECTRICAL CHARACTERISTICS
(T
amb
= 25
°
C; V
S
= 14.5V; R
L
= 8
Ω
; f = 1KHz; unless otherwise
specified.)
Symbol Parameter Test Condition Min. Typ. Max. Unit
V
S
Supply Voltage Range 5 18 V
I
S
Quiescent Current 23 35 mA
I
sb
Stand-By Current Pin 3 shorted to GND 0.3 mA
V
O
Quiescent Output Voltage 7.5 V
A
V
Voltage Gain 31 33 dB
R
IN
Input Impedance 50 100 KΩ
P
O
Output Power THD = 10% 2.7 3 W
THD Distortion P
O
= 1W 0.1 0.3 %
SVR Supply Voltage Rejection V
ripple
= 150mVrms;
F
ripple
= 1KHz
50 dB
E
I
Input Noise Voltage Rg = 10KΩ; BW = 20Hz to 20KHz 5 10 µV
V
sb
Stand-By Enable Voltage 1 V
TDA7267A
3/7
Obsolete Product(s) - Obsolete Product(s)
