MP62180/MP62181 –CURRENT-LIMITED POWER DISTRIBUTION SWITCH
MP62180_MP62181 Rev. 0.9 www.MonolithicPower.com 2
2/23/2010 MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number Enable Switch
Maximum
Continuous
Load Current
Typical Short-
Circuit Current
@ T
A
=25C
Package
Top
Marking
Free Air
Temperature (T
A
)
MP62180DS SOIC8 62180DS
MP62180DD
QFN8E
(2mm x 3mm)
62180DD
MP62180DH
Active
Low
MSOP8E 62180DH
MP62181DS SOIC8 62181DS
MP62181DD
QFN8E
(2mm x 3mm)
62181DD
MP62181DH
Active
High
Single 2A 2.8A
MSOP8E 62181DH
–40°C to +85°C
* For Tape & Reel, add suffix –Z (e.g. MP62180DH–Z).
For RoHS Compliant Packaging, add suffix –LF (e.g. MP62180DH–L)
PACKAGE REFERENCE
1
2
3
4
8
7
6
5
TOP VIEW
GND
IN
IN
EN*
OUT
OUT
OUT
FLAG
EXPOSED PAD
ON BACKSIDE
CONNECT TO GND
TOP VIEW
GND
IN
IN
EN*
1
2
3
4
OUT
OUT
OUT
FLAG
8
7
6
5
EXPOSED PAD
ON BACKSIDE
CONNECT TO GND
GND
IN
IN
EN*
OUT
OUT
OUT
FLAG
1
2
3
4
8
7
6
5
TOP VIEW
MSOP8E QFN8E (2mm x 3mm) SOIC8
MP62180
*: EN is active high for MP62181
ABSOLUTE MAXIMUM RATINGS
(1)
IN .................................................-0.3V to +6.0V
EN, FLAG, OUT to GND ..............-0.3V to +6.0V
Continuous Power Dissipation (T
A
= +25°C)
(2)
MSOP8E.................................................... 2.3W
QFN8E (2mm x 3mm)................................ 2.3W
SOIC8 ........................................................ 1.4W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature...............
–65°C to +150°C
Operating Temperature..............
–40°C to +85°C
Thermal Resistance
(3)
θ
JA
θ
JC
MSOP8E................................. 55 ...... 12... °C/W
QFN8E (2mm x 3mm) ............ 55 ...... 12... °C/W
SOIC8..................................... 90 ...... 42... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature T
J
(MAX), the junction-to-
ambient thermal resistance
JA
, and the ambient temperature
T
A
. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by P
D
(MAX)=(T
J
(MAX)-
T
A
)/
JA
. Exceeding the maximum allowable power dissipation
will cause excessive die temperature, and the regulator will go
into thermal shutdown. Internal thermal shutdown circuitry
protects the device from permanent damage.
3) Measured on JESD51-7, 4-layer PCB.
