MP6231/MP6232 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES
MP6231/MP6232 Rev. 1.2 www.MonolithicPower.com 2
3/31/2010 MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number Enable Switch
Maximum
Continuous
Load Current
Typical Short-
Circuit Current
@ T
A
=25C
Package
Top
Marking
Free Air
Temperature
(T
A
)
MP6231DN* SOIC8E MP6231DN
MP6231DH MSOP8E 6231D
MP6231DS
Active
High
SOIC8
MP6232DN SOIC8E MP6232DN
MP6232DH MSOP8E 6232D
MP6232DS
Active
Low
Dual 0.5A 750mA
SOIC8
-40°C to +85°C
* For Tape & Reel, add suffix –Z (e.g. MP6231DN–Z).
For RoHS compliant packaging, add suffix –LF (e.g. MP6231DN–LF–Z)
PACKAGE REFERENCE
1
2
3
4
8
7
6
5
TOP VIEW
GND
IN
EN1*
EN2*
FLAG1
OUT1
OUT2
FLAG2
EXPOSED PAD
ON BACKSIDE
CONNECT TO GND
MSOP8E
GND
IN
EN1*
EN2*
FLAG1
OUT1
OUT2
FLAG2
1
2
3
4
8
7
6
5
TOP VIEW
EXPOSED PAD
ON BACKSIDE
SOIC8E
GND
IN
EN1*
EN2*
FLAG1
OUT1
OUT2
FLAG2
1
2
3
4
8
7
6
5
TOP VIEW
SOIC8
MP6231/MP6232Dual-Channel
(* EN is active high for MP6231)
ABSOLUTE MAXIMUM RATINGS
(1)
IN .................................................-0.3V to +6.0V
EN, FLAG, OUT to GND ..............-0.3V to +6.0V
Continuous Power Dissipation (T
A
= +25°C)
(2)
SOIC8E...................................................... 2.5W
MSOP8E.................................................. 2.27W
SOIC8 ........................................................ 1.4W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature...............
-65°C to +150°C
Operating Junct. Temp. ...........
-40°C to +125°C
Thermal Resistance
(3)
θ
JA
θ
JC
SOIC8E .................................. 50 ...... 10... °C/W
MSOP8E................................. 55 ...... 12... °C/W
SOIC8..................................... 90 ...... 42... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature T
J
(MAX), the junction-to-
ambient thermal resistance
JA
, and the ambient temperature
T
A
. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by P
D
(MAX) = (T
J
(MAX)-T
A
)/
JA
. Exceeding the maximum allowable powe
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) Measured on JESD51-7， 4-layer PCB.
