MAX13223E
±70V Fault-Protected, 3.0V to 5.5V,
2Tx/2Rx RS-232 Transceiver
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
CC
= +3.0V to +5.5V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at V
CC
= +3.3V, T
A
= +25°C, unless other-
wise noted. For V
CC
= +3.0V to +3.6V, C1 = C2 = C3 = 0.1µF, C4 = 1µF. For V
CC
= +4.5V to +5.5V, C1 = 47nF, C2 = C3 = 330nF,
C4 = 1µF.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(Voltages referenced to GND.)
V
CC
...................................................................... -0.3V to +7.0V
V+ ..........................................................................-0.3V to +7.0V
V- ...........................................................................+0.3V to -7.0V
V+ to V- ................................................................................+13V
Input Voltages
T1IN, T2IN, EN, FORCEON, FORCEOFF ..........-0.3V to +6.0V
R1IN, R2IN .......................................................................±70V
Output Voltages
T1OUT, T2OUT ................................................................±70V
R1OUT, R2OUT, INVALID ......................-0.3V to (V
CC
+ 0.3V)
Short-Circuit Duration
T1OUT, T2OUT.......................................................Continuous
Continuous Power Dissipation (T
A
= +70°C)
TSSOP (derate 13.6mW/°C above +70°C) ................1084mW
Operating Temperature Range .......................... -40°C to +85°C
Junction Temperature..................................................... +150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TSSOP
Junction-to-Ambient Thermal Resistance (θ
JA
) ........73.8°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ................20°C/W
1.0 10 μA
= 1.6mA 0.4 V
0.6
0.2