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2005 Semtech Corp.
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SC1405D
POWER MANAGEMENT
Block Diagram
Applications Information
SC1405D
is designed to drive Low Rds_On power FETs
with ultra-low rise/fall times and propagation delays. As
the switching frequency of PWM controllers is increased
to reduce power supply volume and cost, fast rise and
fall times are necessary to minimize switching losses (TOP
FET) and reduce Dead-time (BOTTOM FET) losses. While
Low Rds_On FETs present a power saving in I
2
R losses,
the FET’s die area is larger and thus the effective input
capacitance of the FET is increased. Often a 50% de-
crease in Rds_On more than doubles the effective input
gate charge, which must be supplied by the driver. The
Rds_On power savings can be offset by the switching
and dead-time losses with a suboptimum driver. While
discrete solution can achieve reasonable drive capabil-
ity, implementing shoot-through, programmable delay and
other housekeeping functions necessary for safe opera-
tion can become cumbersome and costly. The SC1405
family of parts presents a total solution for the high-
speed, high power density applications. Wide input sup-
ply range of 4.5V-25V allows use in battery powered ap-
plications, new high voltage, distributed power servers
as well as Class-D amplifiers.
Theory of Operation
The control input (CO) to the SC1405D is typically sup-
plied by a PWM controller that regulates the power sup-
ply output. (See Application Evaluation Schematic on page
12). The timing diagram demonstrates the sequence of
events by which the top and bottom drive signals are
applied. The shoot-through protection is implemented
by holding the bottom FET off until the voltage at the
phase node (intersection of top FET source, the output
inductor and the bottom FET’s drain) has dropped below
1V. This assures that the top FET has turned off and
that a direct current path does not exist between the
input supply and ground, a condition which both the top
and bottom FETs are on momentarily. The top FET is
also prevented from turning on until the bottom FET is
off. This time is internally set to 20ns (typical) and may
be increased by adding a capacitor from the C-Delay pin
to GND. The delay is approximately 1ns/pF in addition
to the internal 20ns delay. The external capacitor may
be needed if multiple High input capacitance FETs are
used in parallel and the fall time is substantially greater
than 20ns.
It must be noted that increasing the dead-time by high
values of C-Delay capacitor will reduce efficiency since
the parallel Schottky or the bottom FET’s body diode will
have to conduct during dead-time.
Layout Guidelines
As with any high speed , high current circuit, proper lay-
out is critical in achieving optimum performance of the
SC1405D. The Evaluation board schematic on page 12
shows a dual phase synchronous design with all surface
mountable components.
While components connecting to C-Delay, OVP_S, EN,S-
MOD, DSPS_DR and PRDY are relatively noncritical, tight
82005 Semtech Corp.
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SC1405D
POWER MANAGEMENT
placement and short, wide traces must be used in layout
of The Drives, DRN, and especially PGND pin. The top
gate driver supply voltage is provided by bootstrapping
the +5V supply and adding it the phase node voltage
(DRN). Since the bootstrap capacitor supplies the charge
to the TOP gate, it must be less than 0.5” away from the
SC1405. Ceramic X7R capacitors are a good choice for
supply bypassing near the chip. The Vcc pin capacitor
must also be less than 0.5” away from the SC1405. The
ground node of this capacitor, the SC1405 PGND pin
and the Source of the bottom FET must be very close to
each other, preferably with common PCB copper land
and multiple vias to the ground plane (if used). The par-
allel Schottky (if used) must be physically next to the
Bottom FET’s drain and source. Any trace or lead induc-
tance in these connections will drive current way from
the Schottky and allow it to flow through the FET’s body
diode, thus reducing efficiency.
Preventing Inadvertent Bottom FET Turn-on
At high input voltages, (12V and greater) a fast turn-on
of the top FET creates a positive going spike on the Bot-
tom FET’s gate through the Miller capacitance, Crss of
the bottom FET. The voltage appearing on the gate due
to this spike is:
issrss
rssin
spike
CC
C*V
V
+
=
Where Ciss is the input gate capacitance of the bottom
FET. This is assuming that the impedance of the drive
path is too high compared to the instantaneous imped-
ance of the capacitors. (since dV/dT and thus the effec-
tive frequency is very high). If the BG pin of the SC1405D
is very close to the bottom FET, Vspike will be reduced
depending on trace inductance, rate if rise of current,
etc.
While not shown in Application Evaluation Board Sche-
matic on page 12, a capacitor may be added from the
gate of the bottom FET to its source, preferably less than
0.5” away. This capacitor will be added to Ciss in the
above equation to reduce the effective spike voltage,
Vspike.
The selection of the bottom FET must be done with at-
tention paid to the Crss/Ciss ratio. A low ratio reduces
Applications Information
the Miller feedback and thus reduces Vspike. Also FETs
with higher Turn-on threshold voltages will conduct at a
higher voltage and will not turn on during the spike. The
FET shown in the schematic has a 2 volt threshold and
will require approximately 5 volts Vgs to be conducting,
thus reducing the possibility of shoot-through. A zero
ohm bottom FET gate resistor will obviously help keeping
the gate voltage low.
Ultimately, slowing down the top FET by adding gate re-
sistance will reduce di/dt which will in turn make the ef-
fective impedance of the capacitors higher, thus allow-
ing the BG driver to hold the bottom gate voltage low.
Ringing on the Phase Node
The top FET source must be close to the bottom FET
drain to prevent ringing and the possibility of the phase
node going negative. This frequency is determined by:
ossst
ring
C*L2
1
F
Π
=
Where:
L
st
= The effective stray inductance of the top FET added
to trace inductance of the connection between top FET’s
source and the bottom FET’s drain added to the trace
resistance of the bottom FET’s ground connection.
Coss=Drain to source capacitance of bottom FET. If there
is a Schottky used, the capacitance of the Schottky is
added to the value.
Although this ringing does not pose any power losses
due to a fairly high Q, it could cause the phase node to
go too far negative, thus causing improper operation,
double pulsing or at worst driver damage. This ringing is
also an EMI nuisance due to its high resonant frequency.
Adding a capacitor, typically 1000-2000pf, in parallel with
Coss can often eliminate the EMI issue. If double puls-
ing is caused due to excessive ringing, placing 4.7-10
ohm resistor between the phase node and the DRN pin
of the SC1405 should eliminate the double pulsing.
The negative voltage spikes on the phase node adds to
the bootstrap capacitor voltage, thus increasing the volt-
age between VBST - VDRN. If the phase node negative
spikes are too large, the voltage on the boost capacitor
9
2005 Semtech Corp.
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SC1405D
POWER MANAGEMENT
could exceed device’s absolute maximum rating of 8V.
To eliminate the effect of the ringing on the boost
capacitor voltage, place a 4.7 - 10 Ohm resistor between
boost Schottky diode and Vcc to filter the negative spikes
on DRN Pin. Alternately, a Silicon diode, such as the
commonly available 1N4148 can substitute for the
Schottky diode and eliminate the need for the series re-
sistor.
Proper layout will guarantee minimum ringing and elimi-
nate the need for external components. Use of SO-8 or
other surface mount FETs will reduce lead inductance
and their parasitic effects.
ASYNCHRONOUS OPERATION
The SC1405D can be configured to operate in Asynchro-
nous mode by pulling S-MOD to logic LOW, thus disabling
the bottom FET drive. This has the effect of saving power
at light loads since the bottom FET’s gate capacitance
does not have to charged at the switching frequency.
There can be a significant savings since the bottom driver
can supply up to 2A pulses to the FET at the switching
frequency. There is an additional efficiency benefit to
operating in asynchronous mode. When operating in syn-
chronous mode, the inductor current can go negative
and flow in reverse direction when the bottom FET is on
and the DC load is less than 1/2 inductor ripple current.
At that point, the inductor core and wire losses, depend-
ing on the magnitude of the ripple current, can be quite
significant. Operating in asynchronous mode at light loads
effectively only charges the inductor by as much as
needed to supply the load current, since the inductor
never completely discharges at light loads. DC regula-
tion can be an issue when operating in asynchronous
mode, depending on the type of controller used and mini-
mum load required to maintain regulation. If there are
no Shottkey diodes used in parallel with bottom FET, the
FET’s body diode will need to conduct in asynchronous
mode. The high voltage drop of this diode must be con-
sidered when determining the criteria for this mode of
operation.
Applications Information (Cont.)
DSPS DR
This pin produces an output which is a logical duplicate
of the bottom FET’s gate drive, if S-MOD is held High.
OVP_S/OVER TEMP SHUTDOWN
Output over-voltage protection (OVP) may be implemented
on the SC1405D independent of the PWM controller . A
voltage divider from the output is compared with the in-
ternal bandgap voltage of 1.2V (typical). Upon exceeding
this voltage, the overvoltage comparator disables the top
FET, while turning on the bottom FET to allow discharge
of the output capacitors excessive voltage through the
output inductor.
The SC1405D has a unique adaptive OVP circuit. Short
noise pulses, less than ~100ns are rejected completely;
longer pulses will trigger OVP if only of sufficient magni-
tude. A long term transient will trigger OVP with a smaller
magnitude. To assure proper tripping, bypass the resis-
tor from OVP_S pin to GND with a capacitor. The value of
this capacitor must be selected to achieve a time con-
stant equal to one switching period. Leave at least 250mV
headroom on the OVP pin to prevent false OVP events.
The SC1405D will shutdown if its T
J
exceeds 165°C.

SC1405DITSTRT

Mfr. #:
Manufacturer:
Semtech
Description:
Gate Drivers HI SPD SYN PWR MOSFET SMRT DR
Lifecycle:
New from this manufacturer.
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