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HFA30PA60C

P1-P3P4-P6P7-P7
Document Number: 93089 For technical questions, contact: diodestech@vishay.com
www.vishay.com
Revision: 14-Jul-09 1
HEXFRED
®
Ultrafast Soft Recovery Diode, 2 x 15 A
HFA30PA60C
Vishay High Power Products
FEATURES
• Ultrafast recovery
• Ultrasoft recovery
• Very low I
RRM
• Very low Q
rr
• Specified at operating conditions
• Designed and qualified for industrial level
BENEFITS
• Reduced RFI and EMI
• Reduced power loss in diode and switching transistor
• Higher frequency operation
• Reduced snubbing
• Reduced parts count
DESCRIPTION
HFA30PA60C is a state of the art center tap ultrafast
recovery diode. Employing the latest in epitaxial construction
and advanced processing techniques it features a superb
combination of characteristics which result in performance
which is unsurpassed by any rectifier previously available.
With basic ratings of 600 V and 15 A per leg continuous
current, the HFA30PA60C is especially well suited for use as
the companion diode for IGBTs and MOSFETs. In addition to
ultrafast recovery time, the HEXFRED
®
product line features
extremely low values of peak recovery current (I
RRM
) and
does not exhibit any tendency to “snap-off” during the
t
b
portion of recovery. The HEXFRED features combine to
offer designers a rectifier with lower noise and significantly
lower switching losses in both the diode and the switching
transistor. These HEXFRED advantages can help to
significantly reduce snubbing, component count and
heatsink sizes. The HEXFRED HFA30PA60C is ideally
suited for applications in power supplies and power
conversion systems (such as inverters), motor drives, and
many other similar applications where high speed, high
efficiency is needed.
PRODUCT SUMMARY
V
R
600 V
V
F
at 15 A at 25 °C 1.7 V
I
F(AV)
2 x 15 A
t
rr
(typical) 19 ns
T
J
(maximum) 150 °C
Q
rr
(typical) 80 nC
dI
(rec)M
/dt (typical) 160 A/µs
I
RRM
(typical) 4.0 A
TO-247AC
Base
common
cathode
Common
cathode
2
2
13
Anode
1
Anode
2
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Cathode to anode voltage V
R
600 V
Maximum continuous forward current
per leg
I
F
T
C
= 100 °C
15
A
per device 30
Single pulse forward current I
FSM
150
Maximum repetitive forward current I
FRM
60
Maximum power dissipation P
D
T
C
= 25 °C 74
W
T
C
= 100 °C 29
Operating junction and storage temperature range T
J
, T
Stg
- 55 to + 150 °C
www.vishay.com For technical questions, contact: diodestech@vishay.com
Document Number: 93089
2 Revision: 14-Jul-09
HFA30PA60C
Vishay High Power Products
HEXFRED
®
Ultrafast Soft Recovery Diode, 2 x 15 A
ELECTRICAL SPECIFICATIONS PER LEG (T
J
= 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Cathode to anode
breakdown voltage
V
BR
I
R
= 100 µA 600 - -
V
Maximum forward voltage V
FM
I
F
= 15 A
See fig. 1
-1.31.7
I
F
= 30 A - 1.5 2.0
I
F
= 15 A, T
J
= 125 °C - 1.2 1.6
Maximum reverse
leakage current
I
RM
V
R
= V
R
rated
See fig. 2
-1.010
µA
T
J
= 125 °C, V
R
= 0.8 x V
R
rated - 400 1000
Junction capacitance C
T
V
R
= 200 V See fig. 3 - 25 50 pF
Series inductance L
S
Measured lead to lead 5 mm from package body - 12 - nH
DYNAMIC RECOVERY CHARACTERISTICS PER LEG (T
J
= 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Reverse recovery time
See fig. 5, 10
t
rr
I
F
= 1.0 A, dI
F
/dt = 200 A/µs, V
R
= 30 V - 19 -
nst
rr1
T
J
= 25 °C
I
F
= 15 A
dI
F
/dt = 200 A/µs
V
R
= 200 V
-4260
t
rr2
T
J
= 125 °C - 70 120
Peak recovery current
See fig. 6
I
RRM1
T
J
= 25 °C - 4.0 6.0
A
I
RRM2
T
J
= 125 °C - 6.5 10
Reverse recovery charge
See fig. 7
Q
rr1
T
J
= 25 °C - 80 180
nC
Q
rr2
T
J
= 125 °C - 220 600
Peak rate of fall of
recovery current during t
b
See fig. 8
dI
(rec)M
/dt1 T
J
= 25 °C - 250 -
A/µs
dI
(rec)M
/dt2 T
J
= 125 °C - 160 -
THERMAL - MECHANICAL SPECIFICATIONS PER LEG
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Lead temperature T
lead
0.063” from case (1.6 mm) for 10 s - - 300 °C
Junction to case,
single leg conduction
R
thJC
--1.7
K/W
Junction to case,
both legs conducting
- - 0.85
Thermal resistance,
junction to ambient
R
thJA
Typical socket mount - - 40
Thermal resistance,
case to heatsink
R
thCS
Mounting surface, flat, smooth and greased - 0.25 -
Weight
-6.0- g
-0.21- oz.
Mounting torque
6.0
(5.0)
-
12
(10)
kgf · cm
(lbf · in)
Marking device Case style TO-247AC (JEDEC) HFA30PA60C
Document Number: 93089 For technical questions, contact: diodestech@vishay.com
www.vishay.com
Revision: 14-Jul-09 3
HFA30PA60C
HEXFRED
®
Ultrafast Soft Recovery Diode, 2 x 15 A
Vishay High Power Products
Fig. 1 - Maximum Forward Voltage Drop vs.
Instantaneous Forward Current (Per Leg)
Fig. 2 - Typical Reverse Current vs.
Reverse Voltage (Per Leg)
Fig. 3 - Typical Junction Capacitance vs.
Reverse Voltage (Per Leg)
Fig. 4 - Maximum Thermal Impedance Z
thJC
Characteristics (Per Leg)
I
F
- Instantaneous Forward Current (A)
V
FM
- Forward Voltage Drop (V)
1.0 1.2 1.4 1.8 2.21.6 2.0 2.4
1
10
100
93089_01
T
J
= 150 °C
T
J
= 125 °C
T
J
= 25 °C
I
R
- Reverse Current (µA)
V
R
- Reverse Voltage (V)
0 100 200 300 500400 600
0.01
0.1
1
10
100
1000
10 000
93089_02
T
J
= 125 °C
T
J
= 150 °C
T
J
= 25 °C
C
T
- Junction Capacitance (pF)
V
R
- Reverse Voltage (V)
0 100 200 500400300 600
10
100
93089_03
T
J
= 25 °C
0.01
0.1
1
10
0.00001 0.0001 0.001 0.01 0.1 1
t
1
- Rectangular Pulse Duration (s)
Z
thJC
- Thermal Response
93089_04
Single pulse
(thermal response)
P
DM
t
2
t
1
Notes:
1. Duty factor D = t
1
/t
2
2. Peak T
J
= P
DM
x Z
thJC
+ T
C
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
P1-P3P4-P6P7-P7

HFA30PA60C

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Manufacturer:
Vishay
Description:
DIODE ARRAY GP 600V 15A TO247AC
Lifecycle:
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