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MC100H606FNG

P1-P3P4-P6P7-P7
MC10H606, MC100H606
http://onsemi.com
4
Table 6. TTL DC CHARACTERISTICS (V
CCT
= V
CCE
= 5.0 V ±5%)
Symbol Characteristic Condition
T
A
= 0°C T
A
= 25°C T
A
= 85°C
Unit
Min Max Min Max Min Max
V
IH
Input HIGH Voltage 2.0 2.0 2.0 V
V
IL
Input LOW Voltage 0.8 0.8 0.8 V
V
IK
Input Clamp Voltage I
IN
= −18 mA −1.2 −1.2 −1.2 V
I
IH
Input HIGH Current V
IN
= 2.7 V
V
IN
= 7.0 V
20
100
20
100
20
100
V
I
IL
Input LOW Current V
IN
= 0.5 V −0.6 −0.6 −0.6 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Table 7. AC CHARACTERISTICS (V
CCT
= V
CCE
= 5.0 V ±5%)
Symbol Characteristic Condition
T
A
= 0°C T
A
= + 25°C T
A
= + 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
t
PD
Propagation Delay TCLK++
50 W to V
CC
−2.0 V
1.75 3.75 1.75 3.00 3.75 1.75 3.75 ns
t
PD
Propagation Delay TCLK+−
50 W to V
CC
−2.0 V
1.75 3.75 1.75 3.00 3.75 1.75 3.75 ns
t
PD
Propagation Delay CLK++
50 W to V
CC
−2.0 V
1.50 3.50 1.50 2.50 3.50 1.50 3.50 ns
t
PD
Propagation Delay CLK+−
50 W to V
CC
−2.0 V
1.50 3.50 1.50 2.50 3.50 1.50 3.50 ns
t
PD
Propagation Delay MR+−
50 W to V
CC
−2.0 V
1.50 3.50 1.50 2.50 3.50 1.75 3.75 ns
t
SKEW
Device Skew Part−to−Part
Within Device
50 W to V
CC
−2.0 V
2.0
0.5
1.0
0.3
2.0
0.5
2.0
0.5
ns
t
S
Setup Time
50 W to V
CC
−2.0 V
1.5 0.5 1.5 0.5 1.5 0.5 ns
t
H
Hold Time
50 W to V
CC
−2.0 V
1.5 0.5 1.5 0.5 1.5 0.5 ns
t
PW
Minimum Pulse Width CLK
50 W to V
CC
−2.0 V
1.5 1.5 1.0 1.5 ns
t
PW
Minimum Pulse Width MR
50 W to V
CC
−2.0 V
1.5 1.5 1.5 ns
t
r
Rise Time
50 W to V
CC
−2.0 V
2.0 1.0 2.0 2.0 ns
t
f
Fall Time
50 W to V
CC
−2.0 V
2.0 1.0 2.0 2.0 ns
t
RES/REC
Reset/Recovery Time
50 W to V
CC
−2.0 V
2.5 2.0 2.5 2.0 2.5 2.0 ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
MC10H606, MC100H606
http://onsemi.com
5
ORDERING INFORMATION
Device Package Shipping
†
MC10H606FN PLCC−28 37 Units / Rail
MC10H606FNG PLCC−28
(Pb−Free)
37 Units / Rail
MC10H606FNR2 PLCC−28 500 / Tape & Reel
MC10H606FNR2G PLCC−28
(Pb−Free)
500 / Tape & Reel
MC100H606FN PLCC−28 37 Units / Rail
MC100H606FNG PLCC−28
(Pb−Free)
37 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D − ECL Clock Distribution Techniques
AN1406/D − Designing with PECL (ECL at +5.0 V)
AN1503/D −
ECLinPSt I/O SPiCE Modeling Kit
AN1504/D − Metastability and the ECLinPS Family
AN1568/D − Interfacing Between LVDS and ECL
AN1672/D − The ECL Translator Guide
AND8001/D − Odd Number Counters Design
AND8002/D − Marking and Date Codes
AND8020/D − Termination of ECL Logic Devices
AND8066/D − Interfacing with ECLinPS
AND8090/D − AC Characteristics of ECL Devices
MC10H606, MC100H606
http://onsemi.com
6
PACKAGE DIMENSIONS
PLCC−28
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776−02
ISSUE E
−N−
−M−
−L−
V
W
D
D
Y BRK
28 1
VIEW S
S
L−M
S
0.010 (0.250) N
S
T
S
L−M
M
0.007 (0.180) N
S
T
0.004 (0.100)
G1
G
J
C
Z
R
E
A
SEATING
PLANE
S
L−M
M
0.007 (0.180) N
S
T
−T−
B
S
L−M
S
0.010 (0.250) N
S
T
S
L−M
M
0.007 (0.180) N
S
T
U
S
L−M
M
0.007 (0.180) N
S
T
Z
G1X
VIEW D−D
S
L−M
M
0.007 (0.180) N
S
T
K1
VIEW S
H
K
F
S
L−M
M
0.007 (0.180) N
S
T
NOTES:
1. DATUMS −L−, −M−, AND −N− DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM −T−, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.485 0.495 12.32 12.57
B 0.485 0.495 12.32 12.57
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 −−− 0.51 −−−
K 0.025 −−− 0.64 −−−
R 0.450 0.456 11.43 11.58
U 0.450 0.456 11.43 11.58
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y −−− 0.020 −−− 0.50
Z 2 10 2 10
G1 0.410 0.430 10.42 10.92
K1 0.040 −−− 1.02 −−−
__ __
P1-P3P4-P6P7-P7

MC100H606FNG

Mfr. #:
Buy MC100H606FNG
Manufacturer:
ON Semiconductor
Description:
IC TRNSLTR UNIDIRECTIONAL 28PLCC
Lifecycle:
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