STTH802CT

Characteristics STTH802C
4/9 DocID8723 Rev 3
Figure 1. Average forward power dissipation
versus average forward current (per diode)
Figure 2. Forward voltage drop versus forward
current (per diode)
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duration
Figure 4. Junction capacitance versus reverse
applied voltage
(typical values, per diode)
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Figure 5. Reverse recovery charges versus
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Figure 6. Peak reverse recovery current versus
dI
F
/dt (typical values, per diode)
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DocID8723 Rev 3 5/9
STTH802C Characteristics
9
Figure 7. Dynamic parameters versus junction
temperature (reference: T
j
= 125 °C)
Figure 8. Thermal resistance, junction to
ambient, versus copper surface under tab
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Package Information STTH802C
6/9 DocID8723 Rev 3
2 Package Information
Epoxy meets UL94,V0
Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
2.1 DPAK package information
Figure 9. DPAK package outline
Note: This package drawing may slightly differ from the physical package. However, all the
specified dimensions are guaranteed.
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STTH802CT

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
DIODE ARRAY GP 200V 4A TO220AB
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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