MP62130/MP62131 –CURRENT-LIMITED POWER DISTRIBUTION SWITCH
MP62130/MP62131 Rev. 0.9 www.MonolithicPower.com 2
6/15/2010 MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number Enable Switch
Maximum
Continuous
Load Current
Typical Short-
Circuit Current
@ T
A
=25℃
Package
Top
Marking
Free Air
Temperature
(T
A
)
MP62130ES SOIC8 MP62130
MP62130EK*
Active
Low
MSOP8 62130
MP62131ES SOIC8 MP62131
MP62131EK*
Active
High
Single 500mA 650mA
MSOP8 62131
-20°C to +85°C
* For Tape & Reel, add suffix –Z (e.g. MP62130/MP62131EK–Z).
For RoHS Compliant packaging, add suffix –LF (e.g. MP62130/MP62131EK–LF–Z);
PACKAGE REFERENCE
1
2
3
4
8
7
6
5
TOP VIEW
EN*
FLAG
GND
NC
OUT
IN
OUT
NC
MSOP8
EN*
FLAG
GND
NC
OUT
IN
OUT
NC
1
2
3
4
8
7
6
5
TOP VIEW
SOIC8
* EN is active high for MP6231
ABSOLUTE MAXIMUM RATINGS
(1)
IN .................................................-0.3V to +6.5V
EN, FLAG, OUT to GND ..............-0.3V to +6.5V
Continuous Power Dissipation (T
A
= +25°C)
(2)
MSOP8 .................................................... 0.83W
SOIC8..................................................... 1.4W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature...............
-65°C to +150°C
Operating Junct. Temp (T
J
)...... -20°C to +125°C
Thermal Resistance
(3)
θ
JA
θ
JC
MSOP8 .................................. 150 ..... 65... °C/W
SOIC8..................................... 90 ...... 42... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature T
J
(MAX), the junction-to-
ambient thermal resistance
JA
, and the ambient temperature
T
A
. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by P
D
(MAX) = (T
J
(MAX)-T
A
)/
JA
. Exceeding the maximum allowable powe
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) Measured on JESD51-7 4-layer PCB.
