IRLR/U014N
HEXFET
®
Power MOSFET
S
D
G
Parameter Typ. Max. Units
R
θJC
Junction-to-Case ––– 5.3
R
θJA
Case-to-Ambient (PCB mount)** ––– 50 °C/W
R
θJA
Junction-to-Ambient ––– 110
Thermal Resistance
V
DSS
= 55V
R
DS(on)
= 0.14
I
D
= 10A
Description
5/4/99
www.irf.com 1
D-Pak
TO-252AA
I-Pak
TO-251AA
Logic-Level Gate Drive
Surface Mount (IRLR024N)
Straight Lead (IRLU024N)
Advanced Process Technology
Fast Switching
Fully Avalanche Rated
Fifth Generation HEXFETs from International Rectifier utilize advanced
processing techniques to achieve the lowest possible on-resistance per
silicon area. This benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs are well known for,
provides the designer with an extremely efficient device for use in a wide
variety of applications.
The D-PAK is designed for surface mounting using vapor phase, infrared, or
wave soldering techniques. The straight lead version (IRFU series) is for
through-hole mounting applications. Power dissipation levels up to 1.5 watts
are possible in typical surface mount applications.
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .
For recommended footprint and soldering techniques refer to application note #AN-994
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V 10
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V 7.1 A
I
DM
Pulsed Drain Current 40
P
D
@T
C
= 25°C Power Dissipation 28 W
Linear Derating Factor 0.2 W/°C
V
GS
Gate-to-Source Voltage ± 16 V
E
AS
Single Pulse Avalanche Energy 35 mJ
I
AR
Avalanche Current 6.0 A
E
AR
Repetitive Avalanche Energy 2.8 mJ
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
T
J
Operating Junction and -55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
°C
Absolute Maximum Ratings
PD- 94350
IRLR/U014N
2 www.irf.com
S
D
G
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
––– –––
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode)
––– –––
p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– 1.3 V T
J
= 25°C, I
S
= 6A, V
GS
= 0V
t
rr
Reverse Recovery Time ––– 37 56 nS T
J
= 25°C, I
F
= 6A
Q
rr
Reverse RecoveryCharge ––– 48 71 nC di/dt = 100A/µs
t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Source-Drain Ratings and Characteristics
10
40
A
Starting T
J
= 25°C, L = 1.96mH
R
G
= 25, I
AS
= 6A. (See Figure 12)
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
Pulse width 300µs; duty cycle 2%.
This is applied for I-PAK, L
S
of D-PAK is measured between
lead and center of die contact
I
SD
6.0A, di/dt 210A/µs, V
DD
V
(BR)DSS
,
T
J
175°C
Notes:
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 55 ––– ––– VV
GS
= 0V, I
D
= 250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient ––– 0.056 ––– V/°C Reference to 25°C, I
D
= 1mA
––– ––– 0.14 V
GS
= 10V, I
D
= 6A
––– ––– 0.21 V
GS
= 4.5V, I
D
= 5A
V
GS(th)
Gate Threshold Voltage 1.0 ––– ––– VV
DS
= V
GS
, I
D
= 250µA
g
fs
Forward Transconductance 3.1 ––– ––– SV
DS
= 25V, I
D
= 6A
––– ––– 25
µA
V
DS
= 55V, V
GS
= 0V
––– ––– 250 V
DS
= 55V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage ––– ––– 100
nA
V
GS
= 16V
Gate-to-Source Reverse Leakage ––– ––– -100 V
GS
= -16V
Q
g
Total Gate Charge ––– ––– 7.9 I
D
= 6A
Q
gs
Gate-to-Source Charge ––– ––– 1.4 nC V
DS
= 44V
Q
gd
Gate-to-Drain ("Miller") Charge ––– ––– 4.4 V
GS
= 5.0V, See Fig. 6 and 13
t
d(on)
Turn-On Delay Time ––– 6.5 ––– V
DD
= 28V
t
r
Rise Time ––– 47 –––
ns
I
D
= 6A
t
d(off)
Turn-Off Delay Time ––– 12 ––– R
G
= 6.2Ω, V
GS
= 5.0V
t
f
Fall Time ––– 23 ––– R
D
= 4.5Ω, See Fig. 10
Between lead,
6mm (0.25in.)
from package
and center of die contact
C
iss
Input Capacitance ––– 265 ––– V
GS
= 0V
C
oss
Output Capacitance ––– 80 ––– pF V
DS
= 25V
C
rss
Reverse Transfer Capacitance ––– 38 ––– ƒ = 1.0MHz, See Fig. 5
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
nH
I
GSS
S
D
G
L
S
Internal Source Inductance ––– 7.5 –––
R
DS(on)
Static Drain-to-Source On-Resistance
L
D
Internal Drain Inductance ––– 4.5 –––
I
DSS
Drain-to-Source Leakage Current
IRLR/U014N
www.irf.com 3
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
0.1
1
10
100
2.0 4.0 6.0 8.0 10.0
V = 50V
20µs PULSE WIDTH
DS
V , Gate-to-Source Voltage (V)
I , Drain-to-Source Current (A)
GS
D
T=25C
J
°
T = 175 C
J
°
0.1
1
10
100
0.1 1 10 100
20µs PULSE WIDTH
T=25C
J
°
TOP
BOTTOM
VGS
15V
12V
10V
7.0V
5.0V
4.5V
2.7V
2.0V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
2.5V
0.1
1
10
100
0.1 1 10 100
20µs PULSE WIDTH
T = 175 C
J
°
TOP
BOTTOM
VGS
15V
12V
10V
7.0V
5.0V
4.5V
2.7V
2.0V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
2.5V
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
0.0
0.5
1.0
1.5
2.0
2.5
T , Junction Temperature (C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
°
V =
I =
GS
D
10V
10A
VGS
TOP 15V
10V
5.0V
4.5V
3.5V
3.0V
2.7V
BOTTOM 2.5V
VGS
TOP 15V
10V
5.0V
4.5V
3.5V
3.0V
2.7V
BOTTOM 2.5V

IRLR014NTR

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET N-CH 55V 10A DPAK
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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