Vishay Siliconix
Si5905DC
Document Number: 71066
S10-0936-Rev. C, 19-Apr-10
www.vishay.com
1
Dual P-Channel 1.8 V (G-S) MOSFET
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET
®
Power MOSFETs: 1.8 V Rated
• Compliant to RoHS Directive 2002/95/EC
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)I
D
(A)
- 8
0.090 at V
GS
= - 4.5 V ± 4.1
0.130 at V
GS
= - 2.5 V ± 3.4
0.180 at V
GS
= - 1.8 V ± 2.9
Ordering Information: Si5905DC-T1-E3 (Lead (Pb)-free)
Si5905DC-T1-GE3 (Lead (Pb)-free and Halogen-free)
Bottom View
1206-8 ChipFET
S
1
G
1
S
2
G
2
D
1
D
1
D
2
D
2
1
Marking Code
DB XX
Lot Traceability
and Date Code
Part # Code
®
S
1
G
1
D
1
P-C P-Channel MOSFET
S
2
G
2
D
2
hannel MOSFET
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. See reliability manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result
of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure
adequate bottom side solder interconnection.
c. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol 5 s Steady State Unit
Drain-Source Voltage V
DS
- 8
V
Gate-Source Voltage V
GS
± 8
Continuous Drain Current (T
J
= 150 °C)
a
T
A
= 25 °C
I
D
± 4.1 ± 3.0
A
T
A
= 85 °C ± 2.9 ± 2.2
Pulsed Drain Current I
DM
± 10
Continuous Source Current (Diode Conduction)
a
I
S
- 1.8 - 0.9
Maximum Power Dissipation
a
T
A
= 25 °C
P
D
2.1 1.1
W
T
A
= 85 °C 1.1 0.6
Operating Junction and Storage Temperature Range T
J
, T
stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)
b, c
260
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
a
t ≤ 5 s
R
thJA
50 60
°C/WSteady State 90 110
Maximum Junction-to-Foot (Drain) Steady State R
thJF
30 40