NB100ELT23L
www.onsemi.com
3
Table 3. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Unit
V
CC
Power Supply GND = 0 V 3.8 V
V
I
Input Voltage GND = 0 V V
I
≤ V
CC
3.8 V
I
out
Output Current Continuous
Surge
50
100
mA
mA
T
A
Operating Temperature Range −40 to +85 °C
T
stg
Storage Temperature Range −65 to +150 °C
q
JA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
SO−8
SO−8
190
130
°C/W
°C/W
q
JC
Thermal Resistance (Junction−to−Case) Standard Board SO−8 41 to 44 °C/W
q
JA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
°C/W
q
JC
Thermal Resistance (Junction−to−Case) Standard Board TSSOP−8 41 to 44 °C/W
T
sol
Wave Solder Pb−Free <2 to 3 sec @ 260°C 265 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 4. PECL DC CHARACTERISTICS V
CC
= 3.3 V, GND = 0 V (Note 2)
Symbol
Characteristic
−40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
I
CCH
Power Supply Current (Outputs set to HIGH) 10 23 30 10 23 30 10 24 30 mA
I
CCL
Power Supply Current (Outputs set to LOW) 15 26 35 15 26 35 15 27 35 mA
V
IH
Input HIGH Voltage 2075 2420 2075 2420 2075 2420 mV
V
IL
Input LOW Voltage 1355 1675 1355 1675 1355 1675 mV
V
IHCMR
Input HIGH Voltage Common Mode Range
(Note 3)
1.2 3.3 1.2 3.3 1.2 3.3 V
I
IH
Input HIGH Current 150 150 150
mA
I
IL
Input LOW Current −150 −150 −150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm.
2. All values vary 1:1 with V
CC
.
3. V
IHCMR
minimum varies 1:1 with V
EE
, V
IHCMR
max varies 1:1 with V
CC
. The V
IHCMR
range is referenced to the most positive side of the
differential input signal.
