15-Mar.-2015 Ver.1.6
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GYSFFMAXB
Control No.
HD-BA-A (2/2)
Control name
Pin Layout
No.
Pin Name Type Block I/O
Description
18
NC - -
Never to connect.
19
NC - -
Never to connect.
20
NC - -
Never to connect.
21
NC - -
Never to connect.
22
GND Power
GND - GND
23
NC - -
Never to connect.
24
NC - -
Ne
ver to connect.
25
UART_RXD CMOS
UART I
Serial data input for the UART Interface.
Internal 75kΩpull up.
26
UART_TXD CMOS
UART O
Serial data output for the UART Interface.
Internal 75kΩpull up.
27
TIMER CMOS
CLK O
In Backup mode, count and output time interval.
Open drain output. It doesn’t PULL UP in IC.
Prefer to PULL Up outside of IC
*Please Connect to GND in case of an
unnecessary.
28
NC - -
Never to connect.
29
1PPS CMOS
Digital I/O
1pps signal output
(Default: Duty cycle 0.1/ Timing: 3DFix)
30
NC - -
Never to connect.
31
NC - -
Never to connect.
32
RESET CMOS
Digital I
RESET terminal, active LOW
Internal 75kΩpull up
33
GND Power
GND - GND
34
NC - -
Never to connect.
35
NC - -
Never to connect.
36
GND Power
GND - GND
37
GND Power
GND - GND
38
GND Power
GND - GND
39
GND Power
GND - GND
40
GND Power
GND - GND
41
GND Power
GND - GND
42
GND Power
GND - GND
43
GND Power
GND - GND
44
GND Power
GND - GND
45
GND Power
GND - GND
46
GND Power
GND - GND
15-Mar.-2015 Ver.1.6
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GYSFFMAXB
This specification describes desire and conditions especially for mounting.
DesireConditions
(1) Environment conditions for use and storage
1. Store the components in an environment of < 40deg-C/90
RH if they are in a moisture barrier bag
packed by TAIYO YUDEN.
2. Keep the factory ambient conditions at < 30deg-C/60
RH .
3. Store the components in an environment of < 25±5deg-C/10%RH after the bag is opened.
(The condition is also applied to a stay in the manufacture process).
(2) Conditions for handling of products
Make sure all of the moisture barrier bags have no holes, cracks or damages at receiving. If an abnormality
is found on the bag, its moisture level must be checked in accordance with 2 in (2).
Refer to the label on the bag.
1.All of the surface mounting process (reflow process) must be completed in 12 months from the
bag sea date.
2. Make sure humidity in the bag is less than 10%RH immediately after open, using a humidity indicator
card sealed with the components.
3. All of the surface mounting process (reflow process including rework process) must be completed in 168
hours after the bag is opened (inclusive of any other processes).
4. If any conditions in (1) or condition 2 and 3 in (2) are not met, bake the components in accordance with
the conditions at 125deg-C 24hours
5. As a rule, baking the components in accordance with conditions 4 in (2) shall be once.
Control No.
HQ-BA-523 (1/2)
Control name
Handling Precaution
15-Mar.-2015 Ver.1.6
TAIYO YUDEN
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TAIYO YUDEN
GYSFFMAXB
6. Since semi-conductors are inside of the components, they must be free from static electricity while
handled.(<100V) Use ESD protective floor mats, wrist straps, ESD protective footwear,
air ionizers etc. , if necessary.
7. Please make sure that there are lessen mechanical vibration and shock for this module,
and do not drop it.
8. Please recognize pads of back side at surface mount.
9. Please do not wash this module.
10. Please perform temperature conditions of module at reflow within the limits of the following.
Please give the number of times of reflow as a maximum of 2 times.
Control No.
HQ-BA-523 (2/2)
Control name
Handling Precaution
0
50
100
150
200
250
300
IN OUT
Temp (deg)
温度 (℃)
130-180deg Pre-heat:60~120sec
130~180℃予熱時間:60~120
Peak Temp:250degMax
ピーク温度:250℃以下
230deg up:40secMax
230℃超時間:40sec以内

GYSFFMAXB

Mfr. #:
Manufacturer:
Taiyo Yuden
Description:
GPS Modules GPS UART 115.2 22Track / 66Acq Chan
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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