IXFC12N80P

© 2006 IXYS All rights reserved
Symbol Test Conditions Maximum Ratings
V
DSS
T
J
= 25° C to 150° C 800 V
V
DGR
T
J
= 25° C to 150° C; R
GS
= 1 M 800 V
V
GS
Continuous ± 30 V
V
GSM
Transient ± 40 V
I
D25
T
C
= 25° C7A
I
DM
T
C
= 25° C, pulse width limited by T
JM
36 A
I
AR
T
C
= 25° C6A
E
AR
T
C
= 25° C30mJ
E
AS
T
C
= 25° C 1.0 J
dv/dt I
S
I
DM
, di/dt 100 A/µs, V
DD
V
DSS
, 10 V/ns
T
J
150° C, R
G
= 10
P
D
T
C
= 25° C 120 W
T
J
-55 ... +150 °C
T
JM
150 °C
T
stg
-55 ... +150 °C
T
L
1.6 mm (0.062 in.) from case for 10 s 300 °C
T
SOLD
Plastic body for 10 s 260 °C
V
ISOL
50/60 Hz, RMS, t = 1, leads-to-tab 2500 V~
F
C
Mounting Force 11..65/2.5..15 N/lb
Weight 2g
DS99603E(07/06)
Symbol Test Conditions Characteristic Values
(T
J
= 25° C unless otherwise specified) Min. Typ. Max.
BV
DSS
V
GS
= 0 V, I
D
= 250 µA 800 V
V
GS(th)
V
DS
= V
GS
, I
D
= 2.5 mA 3.0 5.5 V
I
GSS
V
GS
= ±30 V, V
DS
= 0 V ±100 nA
I
DSS
V
DS
= V
DSS
25 µA
V
GS
= 0 V T
J
= 125° C 750 µA
R
DS(on)
V
GS
= 10 V, I
D
= I
T,
(Note 1) 0.93 m
Pulse test, t 300 µs, duty cycle d 2 %
IXFC 12N80P
V
DSS
= 800 V
I
D25
= 7 A
R
DS(on)
0.93 m
t
rr
250 ns
N-Channel Enhancement Mode
Fast Intrinsic Diode
Avalanche Rated
PolarHV
TM
HiPerFET
Power MOSFET
ISOPLUS220
TM
(Electrically Isolated Back Surface)
Features
z
Silicon chip on Direct-Copper-Bond
substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
z
Low drain to tab capacitance(<35pF)
z
Low R
DS (on)
HDMOS
TM
process
z
Rugged polysilicon gate cell structure
z
Unclamped Inductive Switching (UIS)
rated
z
Fast intrinsic Rectifier
Applications
z
DC-DC converters
z
Battery chargers
z
Switched-mode and resonant-mode
power supplies
z
DC choppers
z
AC motor control
Advantages
z
Easy assembly: no screws, or isolation
foils required
z
Space savings
z
High power density
z
Low collector capacitance to ground
(low EMI)
Isolated back surface
G = Gate D = Drain
S = Source
ISOPLUS220
TM
(IXFC)
E153432
G
D
S
Advance Technical Information
IXFC 12N80P
IXYS reserves the right to change limits, test conditions, and dimensions.
Symbol Test Conditions Characteristic Values
(T
J
= 25° C unless otherwise specified)
Min. Typ. Max.
g
fs
V
DS
= 20 V; I
D
= I
T
, pulse test 12 18 S
C
iss
2800 pF
C
oss
V
GS
= 0 V, V
DS
= 25 V, f = 1 MHz 210 pF
C
rss
19 pF
t
d(on)
21 ns
t
r
V
GS
= 10 V, V
DS
= 0.5 V
DSS
, I
D
= I
T
22 ns
t
d(off)
R
G
= 10 (External) 62 ns
t
f
22 ns
Q
g(on)
51 nC
Q
gs
V
GS
= 10 V, V
DS
= 0.5 V
DSS
, I
D
= I
T
13 nC
Q
gd
19 nC
R
thJC
1.05 ° C/W
R
thCS
0.21 ° C/W
Source-Drain Diode Characteristic Values
(T
J
= 25° C unless otherwise specified)
Symbol Test Conditions Min. Typ. Max.
I
S
V
GS
= 0 V 12 A
I
SM
Repetitive 36 A
V
SD
I
F
= I
S
, V
GS
= 0 V, 1.5 V
Pulse test, t 300 µs, duty cycle d 2 %
t
rr
I
F
= 12 A, -di/dt = 100 A/µs 250 ns
I
RM
V
R
= 100 V, V
GS
= 0 V 7 A
Q
RM
0.7 µC
ISOPLUS220
TM
(IXFC) Outline
Ref: IXYS CO 0177 R0
Note:
Bottom heatsink (Pin 4) is
electrically isolated from Pin
1,2, or 3.
Note 1: Test Current I
T
= 6 A
ADVANCE TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are
derived from a subjective evaluation of the design, based upon prior knowledge and
experience, and constitute a "considered reflection" of the anticipated objective result. IXYS
reserves the right to change limits, test conditions, and dimensions without notice.
IXYS MOSFETs and IGBTs are covered by 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2
one or moreof the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537

IXFC12N80P

Mfr. #:
Manufacturer:
Description:
MOSFET N-CH 800V 7A ISOPLUS220
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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