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MPXH6300A6U
P1-P3
P4-P6
P7-P9
P10-P12
P13-P14
MPXH6300A
Sensors
Freescale Semicondu
ctor
, Inc.
7
4
Package Information
4.1
Minimum recommended footprint
for surface mounted applications
Surface mount board layout is a cr
itical portion
of the total de
sign. The footprint for th
e semiconductor package must be the
correct size to ensure proper
solder connection interface
betwe
en the board and the package. With the correct pad geometry
,
the packages will self-align when subjected to a solder reflow pr
ocess. It is always recomme
nded
to fabricate boards with a sol
der
mask layer to avoid bridging and/or shorting betwe
en solder
pads, especially on tight tolerances and/or tight layouts.
Figure 9. SSOP footp
rint
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
0.387
9.83
0.150
3.81
0.050
1.27
TYP
MPXH6300A
Sensors
8
Freescale Semiconductor
, In
c.
4.2
Package Dimensions
This drawing is
located at
http://cache.free
scale.com/files/sh
ared/doc/package_info/98ARH9906
6A.pdf
.
Case 98ARH99066A, super small outline package, sur
face mount
MPXH6300A
Sensors
Freescale Semicondu
ctor
, Inc.
9
Case 98ARH99066A, super small outline package, sur
face mount
P1-P3
P4-P6
P7-P9
P10-P12
P13-P14
MPXH6300A6U
Mfr. #:
Buy MPXH6300A6U
Manufacturer:
NXP / Freescale
Description:
Board Mount Pressure Sensors SSOP INTEGRATED
Lifecycle:
New from this manufacturer.
Delivery:
DHL
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EMS
Payment:
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