ADL5601 Data Sheet
Rev. A | Page 12 of 16
BASIC CONNECTIONS
The basic connections for operating the ADL5601 are shown in
Figure 16. Recommended components are listed in Table 5. The
input and output should be ac-coupled with appropriately sized
capacitors (the device characterization was performed with
0.1 μF capacitors). A 5 V dc bias is supplied to the amplifier
through the bias inductor connected to RFOUT (Pin 3). The
bias voltage should be decoupled using a 1 µF capacitor, a 1.2 nF
capacitor, and a 68 pF capacitor.
C6
1µF
C5
1.2nF
C4
68pF
VCC
RFOUT
RFIN
RFIN
GND
GND
RFOUT
1
2 3
GND
ADL5601
(2)
C2
0.1µF
L1
470nH
C1
0.1µF
08219-015
Figure 16. Basic Connections
SOLDERING INFORMATION AND RECOMMENDED
PCB LAND PATTERN
Figure 17 shows the recommended land pattern for the ADL5601.
To minimize thermal impedance, the exposed paddle on the
package underside, along with Pin 2, should be soldered to a
ground plane. If multiple ground layers exist, they should be
stitched together using vias. For more information on land
pattern design and layout, refer to the AN-772 Application
Note, A Design and Manufacturing Guide for the Lead Frame
Chip Scale Package (LFCSP).
1.50mm
3.00mm
1.27mm
0.62mm
3.48mm
1.80mm
0.86mm
5.37mm
0.20mm
0.762mm 0.635mm
0.86mm
08219-101
Figure 17. Recommended Land Pattern
Table 5. Recommended Components for Basic Connections
Frequency C1 C2 L1 C4 C5 C6
50 MHz to 4000 MHz 0.1 µF 0.1 µF 470 nH (Coilcraft 0603LS-NX or equivalent) 68 pF 1.2 nF 1 µF
