Title Engineering Product Specification 3216FF
Revision: F
Printed on: 11/10/04
Sheet 3 of
15
This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design
applications. Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution
of any products. Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a
product has been selected, it should be tested by the user in all possible applications
1. SCOPE
1.1 This Specification applies to 3216FF series fuses.
2. GENERAL
2.1 General Information
• Rapid interruption of excessive current
• Compatible with reflow and wave solder
• Rugged ceramic and glass construction
• Excellent environmental integrity
• One time positive disconnect
2.2 General Description
3216FF Chip fuses set the industry standard for performance, reliability and quality.
The solder-free design provides excellent on-off and temperature cycling characteristics
during use and also makes our Chip fuses more heat and shock tolerant than typical
subminiature fuses.
3. MANUFACTURER AND PRODUCTION FACILITY
3.1 Manufacturer Cooper Electronic Technologies
3601 Quantum Boulevard
Boynton Beach, FL 33426
Telephone: 561-752-5000
Fax: 561-752-0134
3.2 Production Facility a) Cooper Bussmann
114 Old State Road
Ellisville, MO 63021 (USA)
b) Xin Min Industrial Estate
Changan DongGuan
Guandong Province, China
3.3 ISO Registration a) ISO 9002 File Number A4916
b) ISO 9002, Certificate No. Q2273