- The information contained in this document is the property of Cooper Industries, Inc. It is not for public disclosure. Possession of the information
does not convey any right to loan, sell or disclose the CONFIDENTIAL information. Unauthorized reproduction or use of the information is
prohibited. This document is to be returned to Cooper Industries, Inc. Upon completion of the purposes for which it is loaned or upon request.
REV. # Revision Description Date Author Appr.
F Add –R option (for RoHS Compliant version) and China mfg location 11/2/04 MJ MJ
E Add reference to min/max resistance, remove 1.75A device, add glass color reference, add
–T option.
10/30/03 MJ MJ
D Update marking symbols. 10/31/02 DU HS
C Add 1.25A and 1.75A device. 6/08/01 DB RS
B Update TCC to show 7A device. 5/8/01 VK DB
A Original 8/28/00 DG DB
Engineering Product Specification
3216FF
Title Engineering Product Specification 3216FF
Revision: F
Printed on: 11/10/04
Sheet 2 of
15
This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design
applications. Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution
of any products. Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a
product has been selected, it should be tested by the user in all possible applications
Table of Contents
Section
Title Page
1. Scope 3
2. General 3
3. Manufacturer and Production Facility 3
4. Catalog Symbol and Part Numbering System 4
5. Mechanical Specifications 4
6. Electrical Specifications 7
7. Standards and Agency Information 11
8. Marking Specification 13
9. Soldering Method 13
10. Land Pattern 14
11. Temperature Derating Curve 14
12. Packaging Specification 15
13. Process Flow Chart 15
14. Environmental (Reliability / Qualification) Data 15
15. End 15
Title Engineering Product Specification 3216FF
Revision: F
Printed on: 11/10/04
Sheet 3 of
15
This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design
applications. Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution
of any products. Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a
product has been selected, it should be tested by the user in all possible applications
1. SCOPE
1.1 This Specification applies to 3216FF series fuses.
2. GENERAL
2.1 General Information
Rapid interruption of excessive current
Compatible with reflow and wave solder
Rugged ceramic and glass construction
Excellent environmental integrity
One time positive disconnect
2.2 General Description
3216FF Chip fuses set the industry standard for performance, reliability and quality.
The solder-free design provides excellent on-off and temperature cycling characteristics
during use and also makes our Chip fuses more heat and shock tolerant than typical
subminiature fuses.
3. MANUFACTURER AND PRODUCTION FACILITY
3.1 Manufacturer Cooper Electronic Technologies
3601 Quantum Boulevard
Boynton Beach, FL 33426
Telephone: 561-752-5000
Fax: 561-752-0134
3.2 Production Facility a) Cooper Bussmann
114 Old State Road
Ellisville, MO 63021 (USA)
b) Xin Min Industrial Estate
Changan DongGuan
Guandong Province, China
3.3 ISO Registration a) ISO 9002 File Number A4916
b) ISO 9002, Certificate No. Q2273

TR/3216FF-1.25A

Mfr. #:
Manufacturer:
Description:
Surface Mount Fuses 32VADC 1.25A Fast Acting Chip Fuse
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union