NCP2890, NCV2890
http://onsemi.com
13
Figure 38. Demonstration Board for 9−Pin Flip−Chip CSP Device − PCB Layers
Silkscreen Layer
Top Layer Bottom Layer
NCP2890, NCV2890
http://onsemi.com
14
BILL OF MATERIAL
Item Part Description Ref.
PCB
Footprint
Manufacturer
Manufacturer
Reference
1 NCP2890 Audio Amplifier ON Semiconductor NCP2890
2 SMD Resistor 100 K R1 0805 Vishay−Draloric D12CRCW Series
3 SMD Resistor 20 K R2, R3 0805 Vishay−Draloric CRCW0805 Series
4 Ceramic Capacitor 1.0 F 16 V X7R C1 1206 Murata GRM42−6X7R105K16
5 Ceramic Capacitor 390 nF 50 V Z5U C2 1812 Kemet C1812C394M5UAC
6 Ceramic Capacitor 1.0 F 16 V X7R C3 1206 Murata GRM42−6X7R105K16
7 Not Mounted R4, C4
8 BNC Connector J3 Telegartner JO1001A1948
9 I/O Connector. It can be plugged by BLZ5.08/2
(Weidmüller Reference)
J4, J5 Weidmüller SL5.08/2/90B
ORDERING INFORMATION
Device Marking Package Shipping
NCP2890AFCT2 MAG 9−Pin Flip−Chip CSP 3000/Tape and Reel
NCP2890AFCT2G MAH 9−Pin Flip−Chip CSP
(Pb−Free)
3000/Tape and Reel
NCP2890DMR2 MAB Micro8 4000/Tape and Reel
NCP2890DMR2G MAB Micro8
(Pb−Free)
4000/Tape and Reel
NCV2890DMR2G MBZ Micro8
(Pb−Free)
4000/Tape and Reel
NOTE: This product is offered with either eutectic (SnPb−tin/lead) or lead−free solder bumps (G suffix) depending on the PCB assembly
process. The NCP2890AFCT2G version requires a lead−free solder paste and should not be used with a SnPb solder paste.
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NCP2890, NCV2890
http://onsemi.com
15
PACKAGE DIMENSIONS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
ǒ
mm
inches
Ǔ
SCALE 20:1
0.265
0.01
0.50
0.0197
0.50
0.0197
9 PIN FLIP−CHIP
CASE 499E−01
ISSUE A
DIM MIN MAX
MILLIMETERS
A 0.540 0.660
A1 0.210 0.270
A2
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
E
D
−A−
−B−
0.10 C
A2
A
A1
−C−
0.05 C
0.10 C
4 X
SEATING
PLANE
D1
e
E1
e
0.05 C
0.03 C
A B
9 X b
C
B
A
123
D 1.450 BSC
E
0.330 0.390
b 0.290 0.340
e 0.500 BSC
D1 1.000 BSC
E1 1.000 BSC
1.450 BSC
SIDE VIEW
TOP VIEW
BOTTOM VIEW

NCP2890AFCT2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Audio Amplifiers 1W Audio Power Industrial Temp
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union