TMP03/TMP04
–16–
OUTLINE DIMENSIONS
advantage in this application because it produces a linear tem-
perature output while needing only one I/O pin and without
requiring an A/D converter.
PC BOARD
TMP04 IN SURFACE MOUNT PACKAGE
FAST MICROPROCESSOR, DSP, ETC., IN PGA PACKAGE
PGA SOCKET
Figure 13. Monitoring the Temperature of a High Power
Microprocessor Improves System Reliability
Thermal Response Time
The time required for a temperature sensor to settle to a speci-
fied accuracy is a function of the thermal mass of, and the
thermal conductivity between, the sensor and the object being
sensed. Thermal mass is often considered equivalent to capaci-
tance. Thermal conductivity is commonly specified using the
symbol Θ, and can be thought of as thermal resistance. It is
commonly specified in units of degrees per watt of power trans-
ferred across the thermal joint. Thus, the time required for the
TMP03 to settle to the desired accuracy is dependent on the
package selected, the thermal contact established in that par-
ticular application, and the equivalent power of the heat source.
In most applications, the settling time is probably best deter-
mined empirically. The TMP03 output operates at a nominal
frequency of 35 Hz at 25°C, so the minimum settling time reso-
lution is 27 ms.
REV. B
042208-A
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS TO-226-AA
3-Pin Plastic Header-Style Package [TO-92]
(T-3-1)
Dimensions shown in inches and (millimeters)
0.020 (0.51)
0.017 (0.43)
0.014 (0.36)
0.1150 (2.92)
0.0975 (2.48)
0.0800 (2.03)
0.165 (4.19)
0.145 (3.68)
0.125 (3.18)
1
2
3
BOTTOM VIEW
FRONT VIEW
0.0220 (0.56)
0.0185 (0.47)
0.0150 (0.38)
0.105 (2.68)
0.100 (2.54)
0.095 (2.42)
0.055 (1.40)
0.050 (1.27)
0.045 (1.15)
SEATING
PLANE
0.500 (12.70) MIN
0.205 (5.21)
0.190 (4.83)
0.175 (4.45)
0.210 (5.33)
0.190 (4.83)
0.170 (4.32)
8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AA
012407-A
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099)
45°
8°
0°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
4
1
8 5
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2441)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
