NCV33269DR2G

MC33269, NCV33269
http://onsemi.com
4
I
O
, OUTPUT LOAD CURRENT (mA)
in
V
out
-V
Figure 2. Dropout Voltage versus
Output Load Current
1.5
1.3
1.1
0.9
0.7
0.5
0 200 400 600 800 1000
Figure 3. Transient Load Regulation
, DROPOUT VOLTAGE (V)
20 ms/DIV
C
in
= 10 mF
C
O
= 10 mF Tantalum
V
in
= V
O
+ 3.0 V
Preload = 0.1 A
0 A
0.5 A
100
, OUTPUTI
O
V
O
, OUTPUTΔ
VOLTAGE DEVIATIONCURRENT
T
A
= 25°C
T
A
= -40°C
T
A
= 125°C
mV/Div
-55
900
-25 0 25 50 75 100 125
940
980
1020
1060
1100
Figure 4. Dropout Voltage
versus Temperature
Figure 5. MC33269−XX Output DC Current versus
Input−Output Differential Voltage
V
T
A
, AMBIENT TEMPERATURE (°C)
I
O
= 800 mA
, OVERVOLTAGE INPUT THRESHOLD (%V )
FB(OV) FB
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0
2.0 4.0 6.0 8.0 10 12 14 16
INPUT-OUTPUT VOLTAGE DIFFERENTIAL (V)
T
A
= 25°C
MC33269D-XX
L = 25 mm Copper
OUTPUT CURRENT (A)
70
0.1 1.0 10 100
60
50
40
30
20
Figure 6. MC33269 Ripple Rejection
versus Frequency
Figure 7. MC33269−ADJ Ripple Rejection
versus Frequency
RR, RIPPLE REJECTION RATIO (dB)
f, FREQUENCY (kHz)
20
30
40
50
60
70
RR, RIPPLE REJECTION RATIO (dB)
100101.0
f, FREQUENCY (kHz)
V
in
= 8.0 V
V
out
= 5.0 V
I
L
= 800 mA
C
Adj
= 22 mF
T
A
= 25°C
0.1
V
in
= V
O
+ 3.0 V
I
L
= 800 mA
T
A
= 25°C
V
O
= 12 V
V
O
= 3.3 V or 5.0 V
MC33269, NCV33269
http://onsemi.com
5
R , THERMAL RESISTANCE
JAθ
JUNCTION‐TO‐AIR ( C/W)°
40
80
120
160
200
240
280
0.35
0.42
0.50
0.63
0.83
1.25
2.50
010203025155.0
L, LENGTH OF COPPER (mm)
P
D(max)
for T
A
= 50°C
Minimum
Size Pad
P
D
L
L
, MAXIMUM POWER DISSIPATION (W)
Free Air
Mounted
Vertically
R
q
JA
2.0 oz. Copper
Figure 8. SOP−8 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
R , THERMAL RESISTANCE,
JAθ
JUNCTION-TO-AIR ( C/W)°
R
q
JA
2.0 oz.
Copper
Graph represents symmetrical layout
3.0 mmL
L
P
D(max)
for T
A
= 50°C
30
50
70
90
110
130
150
170
L, LENGTH OF COPPER (mm)
02030504010
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
R , THERMAL RESISTANCE,
JAθ
JUNCTION-TO-AIR ( C/W)°
Figure 9. DPAK Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
L
2.0 oz. Copper
R
q
JA
Minimum
Size Pad
Free Air
Mounted
Vertically
P
D(max)
for T
A
= 50°C
L
40
50
60
70
80
90
100
010203025155.0
L, LENGTH OF COPPER (mm)
0
0.4
0.8
1.2
1.6
2.0
2.4
Figure 10. SOT−223 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
MC33269, NCV33269
http://onsemi.com
6
APPLICATIONS INFORMATION
Figures 11 through 15 are typical application circuits. The
output current capability of the regulator is in excess of
800 mA, with a typical dropout voltage of less than 1.0 V.
Internal protective features include current and thermal
limiting.
* The MC33269 requires an external output capacitor for
stability. The capacitor should be at least 10 mF with an
equivalent series resistance (ESR) of less than 10 W but
greater than 0.2 W over the anticipated operating
temperature range. With economical electrolytic capacitors,
cold temperature operation can pose a problem. As
temperature decreases, the capacitance also decreases and
the ESR increases, which could cause the circuit to oscillate.
Also capacitance and ESR of a solid tantalum capacitor is
more stable over temperature. The use of a low ESR ceramic
capacitor placed within close proximity to the output of the
device could cause instability.
** An input bypass capacitor is recommended to improve
transient response or if the regulator is connected to the
supply input filter with long wire lengths. This will reduce
the circuit’s sensitivity to the input line impedance at high
frequencies. A 0.33 mF or larger tantalum, mylar, ceramic,
or other capacitor having low internal impedance at high
frequencies should be chosen. The bypass capacitor should
be mounted with shortest possible lead or track length
directly across the regulators input terminals. Applications
should be tested over all operating conditions to insure
stability.
Internal thermal limiting circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated, typically at
170°C, the output is disabled. There is no hysteresis built
into the thermal limiting circuit. As a result, if the device is
overheating, the output will appear to be oscillating. This
feature is provided to prevent catastrophic failures from
accidental device overheating. It is not intended to be used
as a substitute for proper heat−sinking.
Figure 11. Typical Fixed Output Application
MC33269-XX
V
in
V
out
GND
C
o
10 mF
An input capacitor is not necessary for stability, however
it will improve the overall performance.
Figure 12. Typical Adjustable Output Application
MC33269
V
in
V
out
Adj
C
o
10 mF
C
Adj
***
R1
R2
***C
Adj
is optional, however it will improve the ripple rejection.
The MC34269 develops a 1.25 V reference voltage between the
output and the adjust terminal. Resistor R1, operates with
constant current to flow through it and resistor R2. This current
should be set such that the Adjust Pin current causes negligible
drop across resistor R2. The total current with minimum load
should be greater than 8.0 mA.
Figure 13. Current Regulator
MC33269
V
in
I
out
Adj
R
S
I
out
+
Figure 14. Battery Backed−Up Power Supply
MC33269-XX
V
in
V
out
MC33269-XX
GND
C
o
10 mF
Figure 15. Digitally Controlled Voltage Regulator
MC33269
V
in
V
out
Adj
C
o
10 mF
R1
R2
R
2
sets the maximum output voltage. Each transistor
reduces the output voltage when turned on.
The Schottky diode in series with the ground leg of the upper
regulator shifts its output voltage higher by the forward
voltage drop of the diode. This will cause the lower device
to remain off until the input voltage is removed.
V
out
+ 1.25
ǒ
1 )
R2
R1
Ǔ
)I
Adj
R2
1.25
R
S
C
in
C
in
C
in
C
o
10 mF
C
in
C
in
GND
C
in
**
**
**
**
**
**
*
*
*
*
*

NCV33269DR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
LDO Voltage Controllers 800 MA, ADJUSTABLE 1.35-1
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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