Spec No. JELF243C-0016H-01 P.6/12
MURATA MFG.CO., LTD
Reference Only
8.Mechanical Performance
No.
Item Specification Test Method
8.1 Shear Test Chip coil shall not be damaged
after tested as test method.
Substrate:Glass-epoxy substrate
(in mm)
Force:2N
Hold Duration:5 s±1 s
Applied Direction: Parallel to PCB.
8.2 Bending Test Chip coil shall not be damaged
after tested as test method.
Substrate:Glass-epoxy substrate
(100mm×40mm×0.8mm)
Speed of Applying Force:1mm /s
Deflection:1mm
Hold Duration:30 s
(in mm)
8.3 Vibration Appearance:No damage
Inductance Change: within ±10%
Substrate: Glass-epoxy substrate
Oscillation Frequency:
10Hz to 2000Hz to 10Hz for 20 min
Total amplitude 1.5 mm or Acceleration
amplitude 196 m/s
2
whichever is smaller.
Testing Time:
A period of 2h in each of
3 mutually perpendicular directions.
8.4 Solderability The electrode shall be at least 90%
covered with new solder coating.
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:240°C±5°C
Immersion Time:3s±1s
8.5 Resistance to
Soldering Heat
Appearance:No damage
Inductance Change: within ±10%
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:260°C±5°C
Immersion Time:5s±1s
Then measured after exposure in the room
condition for 24h±2h.
45
R340
F
Deflection
45
Product
Pressure jig
Land
0.3
0.3
0.9
F
Substrate
Chip coil
