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power.pulseelectronics.com
P797.B (09/17)
http://www.power.pulseelectronics.com/contact
SMT Power Inductor
High Current Molded Power Inductor - PA4346.XXXANLT Series
Height: 5.0mm Max
Footprint: 14.0mm x 12.8mm Max
Current Rating: up to 50.0A
Inductance Range: 0.22uH to 15.0uH
Shielded construction and compact design
High current, low DCR, and high efficiency
Minimized acoustic noise and minimized leakage flux
Electrical Specifications @ 25°C - Operating Temperature -55°C to +155°C
Part
Number
Inductance
100KHz, 1V
Rated
Current
DC
Resistance
Saturation
Current
Max.
Mechanical
MAX. TYP.
uH±20% A mΩ mΩ A
PA4346.221ANLT 0.22 50.0 0.61 0.50 60 Footprint 1
PA4346.471ANLT 0.47 34.0 0.9 0.77 58.0 Footprint 1
PA4346.681ANLT 0.68 31.0 1.55 1.3 42.0 Footprint 1
PA4346.102ANLT 1.00 27.0 1.9 1.6 34.0 Footprint 1
PA4346.152ANLT 1.50 22.0 3.8 3.2 28.0 Footprint 2
PA4346.222ANLT 2.20 15.5 4.8 4.0 23.0 Footprint 2
PA4346.332ANLT 3.30 14.0 7.0 6.0 20.5 Footprint 2
PA4346.472ANLT 4.70 12.5 10.2 8.8 16.0 Footprint 2
PA4346.682ANLT 6.80 11.0 16.0 13.0 15.0 Footprint 2
PA4346.103ANLT 10.0 9.0 22.0 19.2 10.5 Footprint 2
PA4346.153ANLT 15.0 8.2 36.0 30.0 9.2 Footprint 2
1. Actual temperature of the component during system operation (ambient plus tempera-
ture rise) must be within the standard operating range.
2. The saturation current is the current at which the initial inductance drops approximately
30% at the stated ambient temperature. This current is determined by placing the com-
ponent in the specified ambient environment and applying a short duration pulse cur-
rent (to eliminate self-heating eect) to the component.
3. The rated current is the DC current required to raise the component temperature by
approximately 40�C. Take note that the components’ performanc varies depending on the
system condition. It is suggested that the component be tested at the system level, to
verify the temperature rise of the component during system operation.
4. The part temperature (ambient+temp rise) should not exceed 155�C under worst case
operating conditions. Circuit design, PCB trace size and thickness, airflow and other cool-
ing provisions all aect the part temperature. Part temperature should be verified in the
end application.
Notes:
