PCB DESIGN AND LAND PATTERN LAYOUT
It is recommended that the PCB land pattern for the ICS-40310 be laid out to a 1:1 ratio to the solder pads on the microphone
package, as shown in Figure 10. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste stencil
pattern layout is shown in Figure 11. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port
of the microphone. A minimum diameter of 0.5 mm is recommended.
Figure 10. PCB Land Pattern Layout (Dimensions shown in millimeters)
Figure 11. Suggested Solder Paste Stencil Pattern Layout (Dimensions shown in millimeters)
PCB MATERIAL AND THICKNESS
The performance of the ICS-40130 is not affected by PCB thickness. The ICS-40310 can be mounted on either a rigid or flexible PCB.
A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method
offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality.
Ø1.55
Ø0.95
1.52
0.90
1.90
1.22
0.68
0.61
0.61
0.61
0.225
Ø1.55
Ø1.05
45° TYP
45° TYP
0.6
0.61
0.6
0.8
0.8
1.22
1.52
Page 10 of 13
Document Number: DS-ICS-40310-00
Revision: 1.0
