19
Figure 7. Module drawing
13.8±0.1
[0.541±0.004]
2.60
[0.10]
55.2±0.2
[2.17±0.01]
13.4±0.1
[0.528±0.004]
DEVICE SHOWN WITH
DUST CAP AND BAIL
WIRE DELATCH
6.25±0.05
[0.246±0.002]
TX
RX
DIMENSIONS ARE IN MILLIMETERS (INCHES)
8.5±0.1
[0.335±0.004]
FRONT EDGE OF SFP
TRANSCEIVER CAGE
0.7 MAX. UNCOMPRESSED
[0.028]
13.0±0.2
[0.512±0.008]
STANDARD DELATCH
6.6
[0.261]
13.50
[0.53]
AREA
FOR
PROCESS
PLUG
14.8 MAX. UNCOMPRESSED
[0.583]
12.1±0.2
[0.48±0.01]
AVAGO AFBR-570xZ
850 nm LASER PROD
21CFR(J) CLASS 1
COUNTRY OF ORIGIN YYWW
TUV XXXXXX
UL
20
Figure 8. SFP host board mechanical layout
2x 1.7
20x 0.5 ± 0.03
0.9
2 ± 0.05 TYP.
0.06 L A S B S
10.53
11.93
20
10
11
PIN 1
20
10
11
PIN 1
0.8
TYP.
10.93
9.6
2x 1.55 ± 0.05
3.2
5
4
3
2
1
1
26.8
5
11x 2.0
3x 10
41.3
42.3
10x 1.05 ± 0.01
16.25
REF.
14.25
11.08
8.58
5.68
11x 2.0
11.93
9.6
4.8
8.48
A
3.68
SEE DET AIL 1
9x 0.95 ± 0.05
2.5
7.17.2
2.5
34.5
16.25
MIN. PITCH
Y
X
DETAIL 1
Æ 0.85 ± 0.05
PCB
EDGE
0.06 S A S B S
Æ 0.1 L A S B S
Æ 0.1 L X A S
Æ 0.1 S X A S
Æ 0.1 S X Y
3x 10
B
NOTES
1. PADS AND VIAS ARE CHASSIS GROUND
2. THROUGH HOLES, PLATING OPTIONAL.
3. HATCHED AREA DENOTES COMPONENT AND
TRACE KEEPOUT (EXCEPT CHASSIS GROUND).
4. AREA DENOTES COMPONENT KEEPOUT
(TRACES ALLOWED).
DIMENSIONS IN MILLIMETERS
21
Figure 9. Assembly drawing.
15
(0.59)
41.73 ± 0.5
(1.64 ± 0.02)
3.5 ± 0.3
(0.14 ± 0.01)
1.7 ± 0.9
(0.07 ± 0.04)
BEZEL
PCB
AREA
FOR
PROCESS
PLUG
10
(0.39)
TO PCB
REF
0.4 ± 0.1
(0.02 ± 0.004)
BELOW PCB
10.4 ± 0.1
(0.41 ± 0.004)
15.25 ± 0.1
(0.60 ± 0.004)
MSA-SPECIFIED BEZEL
16.25 ± 0.1
(0.64 ± 0.004)
MIN. PITCH
DIMENSIONS ARE IN MILLIMETERS (INCHES).
11
(0.43)
1.5
(0.06)
BELOW PCB
REF.
9.8
(0.39)
CAGE ASSEMBLY
REF.
MAX.
MAX.

AFBR-5705LZ

Mfr. #:
Manufacturer:
Description:
Fiber Optic Transmitters, Receivers, Transceivers Transceive
Lifecycle:
New from this manufacturer.
Delivery:
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