IRFIZ48VPBF

IRFIZ48VPbF
HEXFET
®
Power MOSFET
11/13/03
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V 39
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V 27 A
I
DM
Pulsed Drain Current  290
P
D
@T
C
= 25°C Power Dissipation 43 W
Linear Derating Factor 0.29 W/°C
V
GS
Gate-to-Source Voltage ± 20 V
I
AR
Avalanche Current 72 A
E
AR
Repetitive Avalanche Energy 15 mJ
dv/dt Peak Diode Recovery dv/dt  5.3 V/ns
T
J
Operating Junction and -55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
°C
Mounting torque, 6-32 or M3 srew 10 lbf•in (1.1N•m)
Absolute Maximum Ratings
Parameter Typ. Max. Units
R
θJC
Junction-to-Case ––– 3.5 °C/W
R
θJA
Junction-to-Ambient ––– 65
Thermal Resistance
www.irf.com 1
V
DSS
= 60V
R
DS(on)
= 12m
I
D
= 39A
S
D
G
Advanced HEXFET
®
Power MOSFETs from International
Rectifier utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
The TO-220 Fullpak eliminates the need for additional
insulating hardware in commercial-industrial applications.
The moulding compound used provides a high isolation
capability and a low thermal resistance between the tab and
external heatsink. This isolation is equivalent to using a 100
micron mica barrier with standard TO-220 product. The
Fullpak is mounted to a heatsink using a single clip or by a
single screw fixing.
l Advanced Process Technology
l Ultra Low On-Resistance
l Isolated Package
l High Voltage Isolation = 2.5KVRMS
l Fast Switching
l Fully Avalanche Rated
l Optimized for SMPS Applications
l Lead-Free
Description
TO-220 FULLPAK
PD-94834
IRFIZ48VPbF
2 www.irf.com
S
D
G
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
––– –––
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode)
––– –––
p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– 2.0 V T
J
= 25°C, I
S
= 72A, V
GS
= 0V 
t
rr
Reverse Recovery Time ––– 70 100 ns T
J
= 25°C, I
F
= 72A
Q
rr
Reverse Recovery Charge ––– 155 233 nC di/dt = 100A/µs

t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Source-Drain Ratings and Characteristics
39
290
A
Starting T
J
= 25°C, L = 64µH
R
G
= 25, I
AS
= 72A. (See Figure 12)
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
Notes:
I
SD
72A, di/dt 151A/µs, V
DD
V
(BR)DSS
,
T
J
175°C
Pulse width 300µs; duty cycle 2%.
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 60 –– ––– V V
GS
= 0V, I
D
= 250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient ––– 0.064 V/°C Reference to 25°C, I
D
= 1mA
R
DS(on)
Static Drain-to-Source On-Resistance ––– ––– 12.0 m V
GS
= 10V, I
D
= 43A
V
GS(th)
Gate Threshold Voltage 2.0 –– 4.0 V V
DS
= V
GS
, I
D
= 250µA
g
fs
Forward Transconductance 35 ––– –– S V
DS
= 25V, I
D
= 43A
––– ––– 25
µA
V
DS
= 60V, V
GS
= 0V
––– ––– 250 V
DS
= 48V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage ––– ––– 100 V
GS
= 20V
Gate-to-Source Reverse Leakage ––– ––– -100
nA
V
GS
= -20V
Q
g
Total Gate Charge –– –– 110 I
D
= 72A
Q
gs
Gate-to-Source Charge ––– ––– 29 nC V
DS
= 48V
Q
gd
Gate-to-Drain ("Miller") Charge ––– ––– 36 V
GS
= 10V, See Fig. 6 and 13 
t
d(on)
Turn-On Delay Time ––– 7.6 ––– V
DD
= 30V
t
r
Rise Time ––– 200 –– I
D
= 72A
t
d(off)
Turn-Off Delay Time ––– 157 ––– R
G
= 9.1
t
f
Fall Time ––– 166 ––– R
D
= 0.34, See Fig. 10 
Between lead,
––– –––
6mm (0.25in.)
from package
and center of die contact
C
iss
Input Capacitance ––– 1985 ––– V
GS
= 0V
C
oss
Output Capacitance –– 496 ––– V
DS
= 25V
nH
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
L
D
Internal Drain Inductance
L
S
Internal Source Inductance ––– –––
S
D
G
I
GSS
ns
4.5
7.5
I
DSS
Drain-to-Source Leakage Current
E
as
Single Pulse Avalanche Energy  ––– 780 170 mJ I
AS
= 72A, L = 64mH
C
rss
Reverse Transfer Capacitance ––– 91 –– pF ƒ = 1.0MHz, See Fig. 5
This is a typical value at device destruction and represents
operation outside rated limits.
This is a calculated value limited to T
J
= 175°C .
Uses IRFZ48V data and test conditions.
t = 60s, f = 60Hz
IRFIZ48VPbF
www.irf.com 3
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance
Vs. Temperature
1
10
100
1000
0.1 1 10 100
20µs PULSE WIDTH
T = 25 C
J
°
TOP
BOTTOM
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
4.5V
1
10
100
1000
0.1 1 10 100
20µs PULSE WIDTH
T = 175 C
J
°
TOP
BOTTOM
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
4.5V
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
0.0
0.5
1.0
1.5
2.0
2.5
3.0
T , Junction Temperature ( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
°
V =
I =
GS
D
10V
72A
1
10
100
1000
4 6 8 10 12 14
V = 25V
20µs PULSE WIDTH
DS
V , Gate-to-Source Voltage (V)
I , Drain-to-Source Current (A)
GS
D
T = 25 C
J
°
T = 175 C
J
°

IRFIZ48VPBF

Mfr. #:
Manufacturer:
Infineon / IR
Description:
MOSFET MOSFT 60V 39A 12mOhm 73.3nC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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