Output Specifications
Output SpecificationsOutput Specifications
Output Specifications
Voltage set accuracy ± 1 %
Regulation – Input variation Vin min. to Vin max 0.5% max.
– Load variation 10 – 100 %
dual output models unbalanced: 2.0 % max.
dual output models unbalanced: 5.0 % max.
Ripple and noise 100 mVpk-pk max.
(20 MHz Bandwidth)
(with external output capacitor, see Note 1)
Temperature coefficient ± 0.02 % /K
Output current limitation >105% of Iout max., foldback
Short circuit protection indefinite (automatic recovery)
Start-up time 30ms max.
Max. capacitive load 1200μF
General Specifications
General SpecificationsGeneral Specifications
General Specifications
Temperature ranges – Operating –25 °C ... +71°C
– Derating 2.5%/K above 50°C
– Case temperature +100 °C max.
– Storage –40 °C ... +110 °C
Humidity (non condensing) 85 % rel H max.
Reliability, calculated MTBF (MIL-HDBK-217F ground benign)
> 190’000h @ +25°C
Isolation voltage (60sec – Input/Output 1’500 VDC
Isolation capacity – Input/Output 235 pF typ.
Isolation resistance
>100 M Ohm
Switching frequency (fixed)
330 kHz typ. (Pulse width modulation PWM)
Remote On/Off – On: open circuit on pin RC
– Off:
short circuit between pin RC and pin –Vin
Physical Specifications
Physical SpecificationsPhysical Specifications
Physical Specifications
Case material plastic PBT (UL94V-0 rated)
Baseplate non conductive FR4
Potting material silicon (UL94V-0 rated)
Weight 12 g (0.41 oz)
Soldering temperature max. 265 °C / 10sec.
Note 1
Recommended circuit to reduce conducted noise and output ripple & noise:
C1: 33μF low ESR electrolytic capacitor
For dual output models use capacitors for each output
C2: 10μF low ESR electrolytic capacitor
C3: 1μ film capacitor
