© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1058_C0G_RADIAL_MOLDED • 9/8/2017 8
Radial Through Hole Multilayer Ceramic Capacitors – Radial, Molded, C0G Dielectric, 50 – 200 VDC (Commercial Grade)
Table 2 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Solderability J–STD–002
Magnication50X.Conditions:
a)MethodB,4hoursat155°C,dryheatat235°C
b)MethodBat215°Ccategory3
c)MethodD,category3at260°C
Temperature Cycling JESD22 Method JA–104 1,000cycles(−55°Cto+125°C),Measurementat24hours.+/−2hoursaftertestconclusion.
Biased Humidity
MIL–STD–202 Method
103
LoadHumidity:1,000hours85°C/85%RHandRatedVoltage.Add100Kohmresistor.
Measurementat24hours.+/−2hoursaftertestconclusion.
LowVoltHumidity:1,000hours85°C/85%RHand1.5V.Add100Kohmresistor.
Measurementat24hours.+/−2hoursaftertestconclusion.
Moisture Resistance
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered.
Measurementat24hours.+/−2hoursaftertestconclusion.
Thermal Shock
−55°C/+125°C.Note:Numberofcyclesrequired–300.Maximumtransfertime–20
seconds. Dwell time – 15 minutes. Air – Air.
High Temperature Life
108
1,000hoursat125°C(85°CforX5R,Z5UandY5V)with2Xratedvoltageapplied.
Storage Life
150°C,0VDC,for1,000hours.
Vibration
MIL–STD–202 Method
204
5gfor20minutes,12cycleseachof3orientations.Note:Use8"X5"PCB.031"thick7
secure points on one long side and 2 secure points at corners of opposite sides. Parts
mounted within 2" from any secure point. Test from 10 – 2,000 Hz.
Resistance to Soldering
Heat
ConditionB.Nopre-heatofsamples.Note:singlewavesolder–procedure2.
Terminal Strength
ConditionsA(2.3kgor5lbs)
Mechanical Shock
Figure 1 of Method 213, Condition F.
Resistance to Solvents
Add aqueous wash chemical, OKEM Clean or equivalent.
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp,
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC, and maximum
storagehumiditynotexceed70%relativehumidity.Temperatureuctuationsshouldbeminimizedtoavoidcondensationon
the parts, and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability, chip stock
should be used promptly, preferably within 1.5 years of receipt.
