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XBP06V4E4GR-G
● USP-4 Power Dissipation
Board Mount (Tj max = 150℃)
Ambient Temperature (℃)
Power Dissipation Pd (mW)
Thermal Resistance (℃/W)
25 1000
150 0
125.00
Power dissipation data for the USP-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described
condition.
Evaluation Board (Unit: mm)
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
2
in one side)
Copper (Cu) traces occupy 50% of the board area
in top and back faces.
Package heat-sink is tied to the copper traces.
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
2. Power Dissipation vs. Ambient temperature
■PACKAGING INFORMATION
Pd-Ta特性グラフ
0
200
400
600
800
1000
1200
25 50 75 100 125 150
周囲温度Ta(℃)
許容損失Pd(mW)
Pd vs. Ta
Power Dissi
ation: Pd
mW
Ambient Temperature: Ta (℃)