10
FN9235.1
March 11, 2008
ISL9008
Small Outline Transistor Plastic Packages (SC70-5)
D
e1
E
E1
C
L
C
C
L
e
b
C
L
A2
A
A1
C
L
0.20 (0.008) M
0.10 (0.004) C
C
-C-
SEATING
PLANE
45
123
VIEW C
VIEW C
L
R1
R
4X θ1
4X θ1
GAUGE PLANE
L1
SEATING
α
L2
C
PLANE
c
BASE METAL
WITH
c1
b1
PLATING
b
0.4mm
0.75mm
0.65mm
2.1mm
TYPICAL RECOMMENDED LAND PATTERN
P5.049
5 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.031 0.043 0.80 1.10 -
A1 0.000 0.004 0.00 0.10 -
A2 0.031 0.039 0.80 1.00 -
b 0.006 0.012 0.15 0.30 -
b1 0.006 0.010 0.15 0.25
c 0.003 0.009 0.08 0.22 6
c1 0.003 0.009 0.08 0.20 6
D 0.073 0.085 1.85 2.15 3
E 0.071 0.094 1.80 2.40 -
E1 0.045 0.053 1.15 1.35 3
e 0.0256 Ref 0.65 Ref -
e1 0.0512 Ref 1.30 Ref -
L 0.010 0.018 0.26 0.46 4
L1 0.017 Ref. 0.420 Ref. -
L2 0.006 BSC 0.15 BSC
α
0
o
8
o
0
o
8
o
-
N5 55
R 0.004 - 0.10 -
R1 0.004 0.010 0.15 0.25
Rev. 3 7/07
NOTES:
1. Dimensioning and tolerances per ASME Y14.5M-1994.
2. Package conforms to EIAJ SC70 and JEDEC MO-203AA.
3. Dimensions D and E1 are exclusive of mold flash, protrusions,
or gate burrs.
4. Footlength L measured at reference to gauge plane.
5. “N” is the number of terminal positions.
6. These Dimensions apply to the flat section of the lead between
0.08mm and 0.15mm from the lead tip.
7. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only.
