Data Sheet ADG1408/ADG1409
Rev. D | Page 11 of 19
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
EN
V
SS
S1A
S4A
S3A
S2A
A0
GND
V
DD
S1B
S4B
DA DB
S3B
S2B
A1
ADG1409
TOP VIEW
(Not to Scale)
4861-004
Figure 4. ADG1409 Pin Configuration (TSSOP)
NOTES
1. THE EXPOSED PAD IS
CONNECTED INTERNALLY. FOR
INCREASED RELIABILITY OF THE
SOLDER JOINTS AND MAXIMUM
THERM
L CAPABILITY, IT IS
RECOMMENDED THAT THE PAD BE
SOLDERED TO THE SUBSTRATE, V
SS
.
04861-005
12
11
10
1
3
49
2
6
5
7
8
16
15
14
13
V
SS
V
DD
S1A
S2A
S3A
GND
A1
A0
EN
S1B
S2B
S3B
S4A
DA
DB
S4B
ADG1409
TOP VIEW
(Not to Scale)
Figure 5. ADG1409 Pin Configuration (LFCSP)
Table 10. ADG1409 Pin Function Descriptions
Pin No.
TSSOP LFCSP Mnemonic Description
1 15 A0 Logic Control Input.
2 16 EN
Active High Digital Input. When low, the device is disabled and all switches are off. When high,
Ax logic inputs determine on switches.
3 1 V
SS
Most Negative Power Supply Potential. In single supply applications, it can be connected to ground.
4 2 S1A Source Terminal 1A. Can be an input or an output.
5 3 S2A Source Terminal 2A. Can be an input or an output.
6 4 S3A Source Terminal 3A. Can be an input or an output.
7 5 S4A Source Terminal 4A. Can be an input or an output.
8 6 DA Drain Terminal A. Can be an input or an output.
9 7 DB Drain Terminal B. Can be an input or an output.
10 8 S4B Source Terminal 4B. Can be an input or an output.
11 9 S3B Source Terminal 3B. Can be an input or an output.
12 10 S2B Source Terminal 2B. Can be an input or an output.
13 11 S1B Source Terminal 1B. Can be an input or an output.
14 12 V
DD
Most Positive Power Supply Potential.
15 13 GND Ground (0 V) Reference.
16 14 A1 Logic Control Input.
Not
applicable
0 EPAD
Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints
and maximum thermal capability, it is recommended that the pad be soldered to the substrate, V
SS
.
Table 11. ADG1409 Truth Table
A1 A0 EN On Switch Pair
X X 0 None
0 0 1 1
0 1 1 2
1 0 1 3
1 1 1 4