HS1DLW - HS1MLW
CREAT BY ART
- Glass passivated junction chip
- Ideal for automated placement
- Low profile package
- Low power loss, high efficiency
- Halogen-free according to IEC 61249-2-21
Molding compound: UL flammability classification rating 94V-0
Moisture sensitivity level (MSL): level 1, per J-STD-020
Part no. with suffix "H" means AEC-Q101 qualified
Packing code with suffix "G" means green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
SYMBOL HS1DL
HS1GL
HS1JL
HS1KL
HS1ML
UNIT
HDLW HGLW HJLW HKLW HMLW
V
RRM
200 400 600 800 1000 V
V
RMS
140 280 420 560 700 V
V
DC
200 400 600 800 1000 V
I
F(AV)
A
t
rr
ns
C
J
pF
T
J
°C
T
STG
°C
Note 3: Measured at 1 MHz and applied reverse voltage of 4.0V DC.
Version: A1512
1A, 200V - 1000V Hi
h Efficient Surface Mount Rectifiers
FEATURES
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MECHANICAL DATA
Case: SOD-123W
Maximum RMS voltage
SOD-123W
Polarity: Indicated by cathode band
Weight: 0.016 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25°C unless otherwise noted)
Maximum repetitive peak reverse voltage
A
PARAMETER
Marking code
1
30
μA
1
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
V
V
F
1.7
°C/W
150
I
FSM
Maximum reverse recovery time (Note 2)
Typical thermal resistance
R
θJL
R
θJA
Maximum reverse current @ rated V
R
T
J
=25°C
1.3
T
J
=125°C
Note 2: Test conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Taiwan Semiconductor
25
80
Operating junction temperature range
Storage temperature range
Note 1: Pulse test with PW=300μs, 1% duty cycle
- 55 to +175
- 55 to +175
Maximum instantaneous forward voltage (Note 1)
@ 1 A
1.0
50 75
Typical junction capacitance (Note 3)
I
R
716