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DLM11SN450HY2L

P1-P3P4-P5
1. Standard Land Pattern Dimensions
Soldering and Mounting
Chip Common Mode Choke Coil
DL
p
DLM11S
DLM11G
DLP0QS
DLP0NS
DLP11S
DLP11R
DLP11T
DLP1ND
DLP2AD
DLP31S
DLP31D
DLW21S
DLW21H
DLW31SN
DLW43S
DLW44S
DLW5A
DLW5B
oReflow and Flow
oReflow Soldering
DLP31S
DLP31D
DLW5A/5B (Except for DLW5AT_MQ2)
∗
1
: If the pattern is made with wider than 1.2mm (DLW21) /
1.6mm (DLW31S) it may result in components turning
around, because melting speed is different. In the worst
case, short circuit between lines may occur.
∗
2
: If the pattern is made with less than specified dimensions,
in the worst case, short circuit between lines may occur
due to spread of soldering paste or mount placing
accuracy.
∗
3: If the pattern is made with wider than 0.8mm (DLW21) /
1.6mm (DLW31SN), the bending strength will be reduced.
Do not use gild pattern; excess soldering heat may dissolve
metal of a copper wire.
1.0 0.6 1.0
0.7 0.7
2.1
2.8
0.8 Pitch 0.4
2.2-2.6
0.8
Land Pattern
Land Pattern
+ Solder Resist
Solder Resist
(in mm)
DLM11G
0.5
1.5
1.1
0.3
DLP2AD
1.75
0.25
0.5
1.5
0.4
DLW21S/21H/31SN/43S
a∗
3
b
c∗
2
d∗
1
0.9
2.9
5.5
1.3
3.3
4.7
DLP1ND
1.4
0.2
0.4
0.9
0.3
DLW44S
0.8
2.5
5.6
0.9
1.9
3.9
DLW21S/H
DLW31SN
DLW43SH110/220/510
DLW43SH101
0.8
1.6
3.0
3.2
0.4
0.4
1.6
1.6
Series a
1.2
1.6
3.4
3.4
d
2.6
3.7
5.9
5.9
bc
0.55 0.55
1.95
1.55
0.3
0.85
0.3
0.85
0.90
0.30
0.50
0.80
0.3
0.55
0.55
(4)
(1)
(3)
(2)
(4)
(1)
(3)
(2)
DLP11S/DLM11S DLP11R/11TDLP0NSDLP0QS
0.80
0.20
0.71
0.23
DLp Chip Common Mode Choke Coil Soldering and Mounting
o PCB Warping
PCB should be designed so that products are not
subjected to the mechanical stress caused by warping
the board.
Poor example
Products should be located in the sideways direction
(Length: a<b) to the mechanical stress.
Good example
a
b
DLW5AT_MQ2
oReflow Soldering Chip Mounting Side
DLW5AT_MQ2
oFlow Soldering Chip Mounting Side
0.9
2.9
5.5
1.3
3.3
4.7
DLW5AT_MQ2
1.9
6.9
1.3
6.0
Land Pattern
Land Pattern
+ Solder Resist
Solder Resist
(in mm)
2. Solder Paste Printing and Adhesive Application
(in mm)
When reflow soldering the chip common mode choke
coils, the printing must be conducted in accordance with
the following cream solder printing conditions.
If too much solder is applied, the chip will be prone to
damage by mechanical and thermal stress from the PCB
and may crack.
Standard land dimensions should be used for resist and
copper foil patterns.
When flow soldering the chip common mode choke coils,
apply the adhesive in accordance with the following
conditions.
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
DLP
DLW
DLM
oGuideline of solder paste thickness:
80-100μm: DLP0QS
100-150μm: DLW21S/21H/31S, DLP0NS/11S/11R/11T/1ND/2AD/
DLM11S/11G
150μm: DLW43S
150-200μm: DLP31D/31S, DLW44S/5A/5B
*Solderability is subject to reflow conditions and thermal conductivity.
Please make sure that your product has been evaluated in view of your
specifications with our product being mounted to your product.
DLP31S/DLP31D/
DLW5AT_MQ2
Apply 0.3mg of bonding
agent at each chip.
Series Solder Paste Printing Adhesive Application
DLP31S
DLP31D
Coating Position of
Bonding Agent
Coating Position of
Bonding Agent
aba
d
DLW21S/21H/31S
DLP0QS/0NS/11S/11R/11T/31S/DLM11S/11G
a
b
c
d
DLP1ND/2AD/31D
d
c
a ab
DLP0QS
DLP0NS
DLM11S/DLP11S
DLP11R/T
DLP31S
DLM11G
0.3
0.3
0.7
0.5
1.0
0.5
0.23
0.3
0.3
0.3
0.7
0.4
Series a
0.48
0.5
0.55
0.55
2.1
0.7
d
0.2
0.3
0.55
0.55
0.6
0.5
bc
DLW21S/H
DLW31S
0.8
1.6
0.5
0.4
Series a
1.2
1.6
d
2.6
3.7
bc
DLP1ND
DLP2AD
DLP31D
0.3
0.55
1.0
0.2
0.25
0.4
Series a
0.4
0.5
0.8
d
0.3
0.4
0.8
bc
DLp Chip Common Mode Choke Coil Soldering and Mounting
c
DLW44S/5A/5B
c
b
a
d
e
f
DLW5AT_MQ2
Coating Position of
Bonding Agent
DLW43S
a
b
c
d
DLW44S
DLW5A/5B
0.8
0.9
5.6
5.5
Series a
0.9
1.3
d
2.5
2.9
bc
1.9
3.3
e
3.9
4.7
f
DLW43S
3.0 (110/220/510)
3.2 (101)
1.6
Series a
3.4
d
5.9
bc
P1-P3P4-P5

DLM11SN450HY2L

Mfr. #:
Buy DLM11SN450HY2L
Manufacturer:
Murata Electronics
Description:
Common Mode Chokes / Filters 0504 45ohms Shielded
Lifecycle:
New from this manufacturer.
Delivery:
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