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DLW43SH101XP2L

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3. Standard Soldering Conditions
DLp Chip Common Mode Choke Coil Soldering and Mounting
(1) Soldering Methods
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
common mode choke coils.
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
Solder: Use Sn-3.0Ag-0.5Cu solder. Use of Sn-Zn based
solder will deteriorate performance of products.
If using DLP/DLM series with Sn-Zn based solder,
please contact Murata in advance.
Flux:
o Use Rosin-based flux.
In case of DLW21/31 series, use Rosin-based flux with
converting chlorine content of 0.06 to 0.1wt%.
In case of using RA type solder, products should be
cleaned completely with no residual flux.
o Do not use strong acidic flux (with chlorine content
exceeding 0.20wt%)
o Do not use water-soluble flux.
For additional mounting methods, please contact Murata.
oFlow Soldering Profile
(Sn-3.0Ag-0.5Cu Solder)
Series
Pre-heating
Standard Profile Limit Profile
Heating
Temp. (T1) Temp. (T2)
Time. (t1)
150°C 60s min. 250°C 4 to 6s
2 times
max.
5s max.
2 times
max.
265±3°C
Time. (t2)
Heating
Cycle
of Flow
Temp. (T3) Time. (t2)
Cycle
of Flow
T1
T3
T2
Temperature (°C)
Pre-heating
Time (s)
t2
Heating
Limit Profile
Standard Profile
t1
(2) Soldering Profile
oReflow Soldering Profile
(Sn-3.0Ag-0.5Cu Solder)
DLM/DLP
DLW21/31
DLW43S
Series
Standard Profile Limit Profile
Temp. (T1)
Time. (t1)
Heating
220°C min. 30 to 60s 245±3°C
2 times
max.
230°C min. 260°C/10s
2 times
max.
60s max.
220°C min. 30 to 60s 245±3°C
2 times
max.
240°C min. 260°C/10s
2 times
max.
30s max.
Cycle
of Reflow
Peak
Temperature
(T2)
Temp. (T3) Time. (t2)
Heating
Cycle
of Reflow
Peak
Temperature
(T4)
DLW44S/5A/5B
220°C min. 30 to 60s 250±3°C
2 times
max.
230°C min. 260°C/10s
2 times
max.
60s max.
150
180
T2
T4
T3
T1
Temperature (°C)
90s±30s time (s)
t2
t1
Limit Profile
Standard Profile
Pre-heating
DLW5AT_MQ2
DLP31D/31S
DLp Chip Common Mode Choke Coil Soldering and Mounting
(3) Reworking with Solder Iron
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating: 150°C 60s min.
Soldering iron power output / Tip diameter:
30W max. / ø3mm max.
Temperature of soldering iron tip / Soldering time / Times:
350°C max. / 3-4s / 2 times*
1
*
1
DLP0QS, DLP0NS, DLP11S, DLP11T, DLP1ND,
DLP2AD: 380°C max. / 3-4s / 2 times
DLW43S: 350°C max. / 3s / 2 times
Do not allow the tip of the soldering iron to directly
contact the chip.
For additional methods of reworking with a soldering iron,
please contact Murata engineering.
Following conditions should be observed when cleaning
chip EMI filter.
(1) Cleaning Temperature: 60°C max. (40°C max. for
alcohol type cleaner)
(2) Ultrasonic
Output: 20W/liter max.
Duration: 5 minutes max.
Frequency: 28 to 40kHz
(3) Cleaning agent
The following list of cleaning agents have been tested on
the individual components. Evaluation of final assembly
should be completed prior to production.
Do not clean DLW (Except for DLW21H) series.
Before cleaning, please contact Murata engineering.
(a) Alcohol cleaning agent
Isopropyl alcohol (IPA)
(b) Aqueous cleaning agent
Pine Alpha ST-100S
(4) Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agent has been removed with deionized water.
4. Cleaning
P1-P3P4-P5

DLW43SH101XP2L

Mfr. #:
Buy DLW43SH101XP2L
Manufacturer:
Description:
Common Mode Filters / Chokes 1812 100uH@0.1MHz Tol -30%/+80%
Lifecycle:
New from this manufacturer.
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