Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600
Document Number: 002-13915 Rev. *C Revised April 05, 2017
S70GL02GT
2-Gbit (256-MB) 3.0 V Flash Memory
General Description
The Cypress S70GL02GT 2-Gigabit MirrorBit
®
Flash memory device is fabricated on 45-nm MirrorBit
®
Eclipse
process technology.
This device offers a fast page access time of 25 ns with a corresponding random access time of 110 ns. It features a Write Buffer
that allows a maximum of 256 words/512 bytes to be programmed in one operation, resulting in faster effective programming time
than standard single byte/word programming algorithms. This makes the device an ideal product for today’s embedded applications
that require higher density, better performance and lower power consumption.
This document contains information for the S70GL02GT device, which is a dual-die stack of two S29GL01GT dies. For detailed
specifications, refer to the discrete die datasheet provided in the below table.
Distinctive Characteristics
CMOS 3.0-V Core with Versatile I/O™
Two 1024 Megabit (S29GL01GT) in a single 64-ball fortified-
BGA package (see the S29GL01GT datasheet for full
specifications)
45 nm MirrorBit Eclipse process technology
Single supply (V
CC
) for read/program/erase (2.7 V to 3.6 V)
Versatile I/O feature
Wide I/O voltage (V
IO
): 1.65 V to V
CC
×8 and ×16 data bus
16-word/32-byte page read buffer
512-byte programming buffer
Programming in page multiples, up to a maximum of
512 bytes
Sector erase
Uniform 128-KB sectors
S70GL02GT: 2048 sectors
Suspend and Resume commands for Program and Erase
operations
Status Register, Data Polling, and Ready/Busy pin methods
to determine device status
Advanced Sector Protection (ASP)
– Volatile and nonvolatile protection methods for each sector
Separate 1024-bye One Time Program (OTP) array with two
lockable regions
Each device supports Common Flash Interface (CFI)
WP# input
Protects the last sector of the device, regardless of sector
protection settings
Temperature range/grade
Industrial (–40 °C to +85 °C)
Industrial Plus (–40 °C to +105 °C)
Automotive, AEC-Q100 Grade 3 (–40 °C to +85 °C)
Automotive, AEC-Q100 Grade 2 (–40 °C to +105 °C)
100,000 Program-Erase cycles
20-year data retention
Packaging options
64-ball LSH fortified BGA, 13 mm × 11 mm
Document Cypress Document Number
S29GL01GT, S29GL512T Datasheet 002-00247
Document Number: 002-13915 Rev. *C Page 2 of 21
S70GL02GT
Performance Characteristics
Notes
1. Access times are dependent on V
IO
operating ranges. See Ordering Information on page 4 for further details.
Max Read Access Times (ns) (Note 1)
Parameter 2 Gb
Random Access Time (t
ACC
) 110 120
Page Access Time (t
PACC
)2030
CE# Access Time (t
CE
) 110 120
OE# Access Time (t
OE
)2535
Typical Program and Erase Rates
Operation 40 °C to +85 °C 40 °C to +105 °C
Buffer Programming (512 bytes) 1.114 MBps 1.14 MBps
Sector Erase (128 KB) 245 KBps 245 KBps
Maximum Current Consumption
Operation 40 °C to +85 °C 40 °C to +105 °C
Active Read at 5 MHz, 30 pF 60 mA 60 mA
Program 100 mA 100 mA
Erase 100 mA 100 mA
Standby 200 µA 400 µA
Document Number: 002-13915 Rev. *C Page 3 of 21
S70GL02GT
Contents
1. Ordering Information................................................... 4
1.1 Recommended Combinations........................................ 4
2. Input/Output Descriptions
and Logic Symbol......................................................... 6
3. Block Diagram.............................................................. 7
3.1 Special Handling Instructions
for BGA Package ........................................................... 8
3.2 LSH064 — 64 ball Fortified Ball Grid Array,
13 x 11 mm.................................................................... 9
4. Memory Map............................................................... 10
5. Autoselect................................................................... 10
6. DC Characteristics..................................................... 11
7. BGA Package Capacitance ....................................... 13
8. Thermal Resistance................................................... 13
9. Data Integrity............................................................... 13
9.1 Erase Endurance.......................................................... 13
9.2 Data Retention.............................................................. 13
10. Device ID and Common Flash
Interface (ID-CFI) ASO Map........................................ 14
11. Other Resources......................................................... 19
11.1 Cypress Flash Memory Roadmap ................................ 19
11.2 Links to Software .......................................................... 19
11.3 Links to Application Notes............................................. 19
12. Revision History.......................................................... 20
Document History Page ..................................................... 20
Sales, Solutions, and Legal Information .......................... 21
Worldwide Sales and Design Support ........................... 21
Products ........................................................................ 21
PSoC® Solutions .......................................................... 21
Cypress Developer Community ..................................... 21
Technical Support ......................................................... 21

S70GL02GT11FHV013

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
NOR Flash Nor
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