NCT1008
http://onsemi.com
20
PACKAGE DIMENSIONS
DFN8 3x3, 0.5P
CASE 506BJ−01
ISSUE O
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERMASK DEFINED
3.30
8X
DIMENSION: MILLIMETERS
0.63
1.55
1.85
0.50
PITCH
8X
0.35
MOUNTING FOOTPRINT*
PIN 1
REFERENCE
A
B
C0.10
2X
2X
TOP VIEW
D
E
C0.10
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30
MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
E2
BOTTOM VIEW
b
0.10
8X
L
14
0.05
C AB
C
D2
e
K
85
8X
8X
(A3)
C
C0.05
8X
C0.05
SIDE VIEW
A1
A
SEATING
PLANE
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.18 0.30
D 3.00 BSC
D2 1.64 1.84
E 3.00 BSC
E2 1.35 1.55
e 0.50 BSC
K 0.20 −−−
L 0.30 0.50
NOTE 3
L
DETAIL A
OPTIONAL
CONSTRUCTION
L1
DETAIL A
DETAIL B
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
L
OPTIONAL
CONSTRUCTION
OPTIONAL
CONSTRUCTION
L1 0.00 0.03
NOTE 4
DETAIL B
DETAIL A
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