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PCNM1206E1002BST5

P1-P3P4-P5
PCNM
www.vishay.com
Vishay Dale Thin Film
Revision: 15-Jun-16
1
Document Number: 60130
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
High Power Aluminum Nitride, Wraparound Surface Mount,
Precision Thin Film Non-Magnetic Chip Resistor (up to 6 W)
PCNM series chip resistors are designed on aluminum
nitride ceramic substrates with enlarged backside
terminations to reduce the thermal resistance between the
topside resistor layer and the solder joint on the end users
circuit assembly.
Actual power handling capability is limited by the end user
mounting process. As with any high power chip resistor the
ability to remove the heat is critical to the overall
performance of the device.
FEATURES
• High thermal conductivity aluminum nitride substrate
• Power rating up to 6.0 W
• Resistance range 2 to 30.1 k
• Resistor tolerance to ± 0.1 %
• TCR to ± 25 ppm/°C
• Flame resistant UL 94 V-0
APPLICATIONS
• Power supplies
• Power switching
• Braking system
TYPICAL PERFORMANCE
Note
(1)
Dependant on component mounting by user.
Notes
• 0603 and 0805 case size under engineering qualification.
(2)
Dependant on component mounting by user.
ABSOLUTE
TCR 25
TOL. 0.1
STANDARD ELECTRICAL SPECIFICATIONS
TEST SPECIFICATIONS CONDITIONS
Material Nichrome -
Resistance Range 2 to 30.1 k -
TCR: Absolute 25 ppm/°C (standard) and 100 ppm/°C -
Tolerance: Absolute 0.1 %, 0.25 %, 0.5 %, 1.0 % and 5.0 % -55 °C to +150 °C
Power Rating: Resistor 0.5 W to 6.0 W
(1)
Maximum at +70 °C
Stability: Absolute R 1.0 % 1000 h at +70 °C
Voltage Coefficient < 0.1 ppm/V -
Working Voltage 75 V to 200 V -
Operating Temperature Range -55 °C to +155 °C -
Storage Temperature Range -55 °C to +155 °C -
Noise < -30 dB -
Shelf Life Stability: Absolute ± 0.01 % 1 year at +25 °C
COMPONENT RATINGS
CASE SIZE POWER RATING (mW) WORKING VOLTAGE (V) RESISTANCE RANGE ()
1206 2000
(2)
200 2 to 30.1K
2512 6000
(2)
200 2 to 30.1K
PCNM
www.vishay.com
Vishay Dale Thin Film
Revision: 15-Jun-16
2
Document Number: 60130
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
ENVIRONMENTAL TESTS
ENVIRONMENTAL TEST
LIMITS MIL-PRF-55342
CHARACTERISTIC “H”
TYPICAL VISHAY
PERFORMANCE
Resistance temperature characteristic ± 50 ppm/°C ± 25 ppm/°C
Maximum ambient temperature at rated wattage +70 °C +70 °C
Maximum ambient temperature at power derating +150 °C +150 °C
Thermal shock ± 0.25 % ± 0.10 %
Low temperature operation ± 0.25 % ± 0.10 %
Short time overload ± 0.1 % ± 0.10 %
High temperature exposure ± 0.2 % ± 0.10 %
Resistance to soldering heat ± 0.25 % ± 0.10 %
Moisture resistance ± 0.4 % ± 0.50 %
Life at +70 °C for 1000 h ± 0.5 % ± 1.00 %
DIMENSIONS in inches
CASE SIZE
LENGTH
L
WIDTH
W
THICKNESS
T
MIN./MAX.
TOP PAD
D
BOTTOM PAD
E
1206 0.126 ± 0.008 0.063 ± 0.005 0.015 ± 0.003 0.020 + 0.005 / - 0.010 0.040 ± 0.005
2512 0.259 + 0.009 / - 0.015 0.124 ± 0.005 0.015 ± 0.003 0.020 ± 0.005 0.050 ± 0.005
LAND PATTERN DIMENSIONS in inches
STANDARD MATERIAL SPECIFICATIONS
Resistive element Nichrome
Substrate material Aluminum nitride
Terminations (tin / lead) Tin / lead solder over nickel barrier
Terminations (lead (Pb)-free) Tin / silver / copper (Sn96.5 / Ag3.0 / Cu0.5) solder over nickel barrier
D
L
E
T
W
L
DT
0.2910
0.1260
0.0910
0.1090
2512 Land Pattern
0.1730
0.0710
0.0755
0.0220
1206 Land Pattern
PCNM
www.vishay.com
Vishay Dale Thin Film
Revision: 15-Jun-16
3
Document Number: 60130
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
• Chip surface temperature measured using FLIR SC645 thermal
imaging system with an approximate test card surface
temperature of 75 °C.
Note
• Chip surface temperature measured using FLIR SC645 thermal
imaging system with an approximate test card surface
temperature of 75 °C.
PCAN1206 CHIP TEMP VS. APPLIED POWER
70 150 200
Applied Power (W)
Chip Surface Temperature Temperature (°C)
12.0
10.0
8.0
6.0
4.0
2.0
0.0
10 Ω
1000 Ω
100 Ω
PCNM2512 CHIP TEMP VS. APPLIED POWER
70 150 200
Applied Power (W)
Chip Surface Temperature Temperature (°C)
16.0
10.0
8.0
6.0
4.0
2.0
0.0
10 Ω
14.0
12.0
1000 Ω
10 000 Ω
100 Ω
DERATING CURVE
Ambient Temperature °C
0155
0
20
40
60
80
100
Percent of Rated Power
70 125
P1-P3P4-P5

PCNM1206E1002BST5

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Thin Film Resistors - SMD 1watt 10Kohms .1% 25ppm
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