Features
• Easy Pick And Place
• High Temp Soldering: 260°C for 10 Seconds At Terminals
• Fast Recovery Times For High Efficiency
Maximum Ratings
• Operating Temperature: -50°C to +150°C
• Storage Temperature: -50°C to +150°C
• Maximum Thermal Resistance; 15 °C/W Junction To Lead
MCC
Catalog
Number
Device
Marking
Maximum
Recurrent
Peak Reverse
Voltage
Maximum
RMS
Voltage
Maximum
DC
Blocking
Voltage
FS1A-L FS1A 50V 35V 50V
FS1B-L FS1B 100V 70V 100V
FS1D-L FS1D 200V 140V 200V
FS1G-L FS1G 400V 280V 400V
FS1J-L FS1J 600V 420V 600V
FS1K-L FS1K 800V 560V 800V
FS1M-L FS1M 1000V 700V 1000V
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
current
I
F(AV)
1.0A
T
a
= 90°C
Peak Forward Surge
Current
I
FSM
30A 8.3ms, half sine
Maximum
Instantaneous
Forward Voltage
V
F
1.30V
I
FM
= 1.0A;
T
J
= 25°C*
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
I
R
5µA
200µA
T
J
= 25°C
T
J
= 125°C
Maximum Reverse
Recovery Time
FS1A-L-G-L
FS1J-L
FS1K-L-M-L
T
rr
150ns
250ns
500ns
I
F
=0.5A, I
R
=1.0A,
I
rr
=0.25A
Typical Junction
Capacitance
C
J
15pF Measured at
1.0MHz, V
R
=4.0V
*Pulse test: Pulse width 200 µsec, Duty cycle 2%
FS1A-L
THRU
FS1M-L
Silicon Rectifier
50 to 1000 Volts
1 Amp Fast Recovery
omponents
20736 Marilla Street Chatsworth
!"#
$% !"#
MCC
Revision: C 2013/04/17
DO-214AC
(SMA) (LEAD FRAME)
H
J
G
D
0.070”
0.090”
0.085”
SUGGESTED SOLDER
PAD LAYOUT
DIMENSIONS
INCHES MM
DIM MIN MAX MIN MAX NOTE
A .079 .096 2.00 2.44
B .050 .064 1.27 1.63
C .002 .008 .05 .20
D --- .02 --- .51
E .030 .060 .76 1.52
F .065 .091 1.65 2.32
G .189 .220 4.80 5.59
H .157 .181 4.00 4.60
J .090 .115 2.25 2.92
TM
Micro Commercial Components
www.mccsemi.com
1 of 4
• Halogen free available upon request by adding suffix "-HF"
• Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
Compliant. See ordering information)
Notes:1.High Temperature Solder Exemption Applied,see EU Directive Annex Notes 7.
