SI4925DDY-T1-GE3

Vishay Siliconix
Si4925DDY
New Product
Document Number: 68969
S-82574-Rev. A, 27-Oct-08
www.vishay.com
1
Dual P-Channel 30-V (D-S) MOSFET
FEATURES
Halogen-free
•TrenchFET
®
Power MOSFET
100 % UIS Tested
APPLICATIONS
Load Switches
- Notebook PCs
- Desktop PCs
- Game Stations
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)
I
D
(A)
d, e
Q
g
(Typ.)
- 30
0.029 at V
GS
= - 10 V - 8
15 nC
0.041 at V
GS
= - 4.5 V - 8
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. Maximum under Steady State conditions is 85 °C/W.
d. Based on T
C
= 25 °C.
e. Limited by package.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
- 30
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
- 8.0
e
A
T
C
= 70 °C
- 8.0
e
T
A
= 25 °C
- 7.3
a, b
T
A
= 70 °C
- 5.9
a, b
Pulsed Drain Current
I
DM
- 32
e
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
- 4.1
T
A
= 25 °C
- 2.0
a, b
Avalanche Current
L = 0.1 mH
I
AS
- 20
Single-Pulse Avalanche Energy
E
AS
20 mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
5.0
W
T
C
= 70 °C 3.2
T
A
= 25 °C
2.5
a, b
T
A
= 70 °C
1.6
a, b
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150 °C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
a, c
t 10 s
R
thJA
38 50
°C/W
Maximum Junction-to-Foot
Steady State
R
thJF
20 25
S
1
G
1
D
1
P-Channel MOSFET
S
2
G
2
D
2
P-Channel MOSFET
S
1
D
1
G
1
D
1
S
2
D
2
G
2
D
2
SO-8
5
6
7
8
Top View
2
3
4
1
Ordering Information: Si4925DDY-T1-GE3 (Lead (Pb)-free and Halogen-free)
RoHS
COMPLIANT
www.vishay.com
2
Document Number: 68969
S-82574-Rev. A, 27-Oct-08
Vishay Siliconix
Si4925DDY
New Product
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= - 250 µA
- 30 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= - 250 µA
- 31
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
4.5
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= - 250 µA
- 1.0 - 3.0 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= - 30 V, V
GS
= 0 V
- 1
µA
V
DS
= - 30 V, V
GS
= 0 V, T
J
= 55 °C
- 5
On-State Drain Current
a
I
D(on)
V
DS
- 10 V, V
GS
= - 10 V - 30 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= - 10 V, I
D
= - 7.3 A
0.024 0.029
Ω
V
GS
= - 4.5 V, I
D
= - 6.2 A
0.033 0.041
Forward Transconductance
a
g
fs
V
DS
= - 10 V, I
D
= - 9.1 A
23 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= - 15 V, V
GS
= 0 V, f = 1 MHz
1350
pFOutput Capacitance
C
oss
215
Reverse Transfer Capacitance
C
rss
185
Total Gate Charge
Q
g
V
DS
= - 15 V, V
GS
= - 10 V, I
D
= - 9.1 A
32 50
nC
V
DS
= - 15 V, V
GS
= - 4.5 V, I
D
= - 9.1 A
15 25
Gate-Source Charge
Q
gs
4
Gate-Drain Charge
Q
gd
7.5
Gate Resistance
R
g
f = 1 MHz 5.8 Ω
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 15 V, R
L
= 15 Ω
I
D
- 1 A, V
GEN
= - 10 V, R
g
= 1 Ω
10 15
ns
Rise Time
t
r
815
Turn-Off DelayTime
t
d(off)
45 70
Fall Time
t
f
12 25
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 15 V, R
L
= 15 Ω
I
D
- 1 A, V
GEN
= - 4.5 V, R
g
= 1 Ω
42 70
Rise Time
t
r
35 60
Turn-Off DelayTime
t
d(off)
40 70
Fall Time
t
f
16 30
Drain-Source Body Diode Characteristics
Continous Source-Drain Diode Current I
S
T
C
= 25 °C - 4.1
A
Pulse Diode Forward Current I
SM
- 32
Body Diode Voltage V
SD
I
S
= - 2 A, V
GS
= 0 V - 0.75 - 1.2 V
Body Diode Reverse Recovery Time t
rr
I
F
= - 2 A, dI/dt = 100 A/µs, T
J
= 25 °C
34 60 ns
Body Diode Reverse Recovery Charge Q
rr
22 40 nC
Reverse Recovery Fall Time t
a
11
ns
Reverse Recovery Rise Time t
b
23
Document Number: 68969
S-82574-Rev. A, 27-Oct-08
www.vishay.com
3
Vishay Siliconix
Si4925DDY
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current
Gate Charge
0
10
20
30
40
0.0 0.5 1.0 1.5 2.0
V
GS
=10thru 5 V
V
GS
=3V
V
GS
=4V
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
0.00
0.02
0.04
0.06
0.08
010203040
V
GS
=4.5V
V
GS
=10V
- On-Resistance (Ω)R
DS(on)
I
D
- Drain Current (A)
0
2
4
6
8
10
0918 27 36
V
DS
=22.5V
I
D
=9.1A
V
DS
=15V
V
DS
=7.5V
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0.0
0.2
0.4
0.6
0.8
1.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0
T
C
= 25 °C
T
C
= 125 °C
T
C
=- 55 °C
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
0
600
1200
1800
2400
0 6 12 18 24 30
C
iss
C
oss
C
rss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
0.6
0.9
1.2
1.5
1.8
- 50 - 25 0 25 50 75 100 125 150
V
GS
=10V
V
GS
=4.5V
I
D
=7.3A
T
J
-Junction Temperature (°C)
(Normalized)
- On-ResistanceR
DS(on)

SI4925DDY-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET -30V Vds 20V Vgs SO-8
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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