HLMP-CW23-SV000

7
Figure 6b. CW2x spatial radiation pattern
RELATIVE LUMINOUS INTENSITY
1
0
ANGULAR DISPLACEMENT – DEGREES
0.5
-90 -60 0-30 30 60 90
Figure 6c. CW3x spatial radiation pattern
RELATIVE LUMINOUS INTENSITY
1
0
ANGULAR DISPLACEMENT – DEGREES
0.5
-90 -60 0-30 30 60 90
Figure 6c. CW7x spatial radiation pattern
RELATIVE LUMINOUS INTENSITY
1
0
ANGULAR DISPLACEMENT – DEGREES
0.5
-90 -60 0-30 30 60 90
8
Intensity Bin Limits
(mcd at 20 mA)
Bin Min. Max.
L 400 520
M 520 680
N 680 880
P 880 1150
Q 1150 1500
R 1500 1900
S 1900 2500
T 2500 3200
U 3200 4200
V 4200 5500
W 5500 7200
X 7200 9300
Y 9300 12000
Z 12000 16000
Tolerance for each bin limit is ± 15%.
Color Bin Limit Table
Rank Limits (Chromaticity Coordinates)
1 x 0.330 0.330 0.356 0.361
y 0.360 0.318 0.351 0.385
2 x 0.287 0.296 0.330 0.330
y 0.295 0.276 0.318 0.339
3 x 0.264 0.280 0.296 0.283
y 0.267 0.248 0.276 0.305
4 x 0.283 0.287 0.330 0.330
y 0.305 0.295 0.339 0.360
Tolerance for each bin limit is ± 0.01.
0.40
0.35
0.30
0.25
0.20
0.26 0.30 0.34 0.38
Y-COORDINATE
X-COORDINATE
3
2
4
1
BLACK
BODY
CURVE
Color Bin Limits with Respect to CIE
1931 Chromaticity Diagram
Note:
Bin categories are established for classication of products. Products may not be available in all
bin categories. Please contact your Avago representative for information on currently available
bins.
Relative Light Output vs. Junction Temperature
0.1
1
10
-40 -20 0 20 40 60 80 100
TJ - JUNCTION TEMPERATURE - °C
RELATIVE LIGHT OUTPUT
( NORMALIZED AT TJ = 25ºC)
9
Note:
1. PCB with dierent size and design (component density) will have
dierent heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
prole again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high eciency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
Avago Technologies LED conguration
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
Any alignment xture that is being applied during
wave soldering should be loosely tted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to
cool down to room temperature prior to handling,
which includes removal of alignment xture or pallet.
If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reow soldering prior to insertion the TH LED.
Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause diculty inserting the TH LED.
Precautions:
Lead Forming:
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms
a mechanical ground which prevents mechanical
stress due to lead cutting from traveling into LED
package. This is highly recommended for hand solder
operation, as the excess lead length also acts as small
heat sink.
Soldering and Handling:
Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
LED component may be eectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The
closest manual soldering distance of the soldering
heat source (soldering irons tip) to the body is
1.59mm. Soldering the LED using soldering iron tip
closer than 1.59mm might damage the LED.
1.59mm
ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
Recommended soldering condition:
Wave
Soldering
[1, 2]
Manual Solder
Dipping
Pre-heat temperature 105 °C Max. -
Preheat time 60 sec Max -
Peak temperature 250 °C Max. 260 °C Max.
Dwell time 3 sec Max. 5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering prole to
ensure that it is always conforming to recommended
soldering conditions.
CATHODE
InGaN Device

HLMP-CW23-SV000

Mfr. #:
Manufacturer:
Broadcom / Avago
Description:
LED COOL WHITE CLEAR T-1 3/4 T/H
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union