TSOP853.., TSOP855..
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Not for New Designs
Rev. 1.9, 07-Nov-13
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Document Number: 81860
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Fig. 9 - Maximal Envelope Duty Cycle vs. Burst Length
Fig. 10 - Sensitivity vs. Ambient Temperature
Fig. 11 - Relative Spectral Sensitivity vs. Wavelength
Fig. 12 - Directivity
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0 20 40 60 80 100 120
Burst Length (number of cycles/burst)
Max. Envelope Duty Cycle
22180-4
f = 38 kHz, E
e
= 2 mW/m²
TSOP855..
TSOP853..
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.18
0.2
- 30 - 10 10 30 50 70 90
T
amb
- Ambient Temperature (°C)
E
e min.
- Threshold Irradiance (mW/m²)
20749
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
700 750 800 850 900 950 1000 1050 1100
λ - Wavelength (nm)
S(λ)
rel
- Relative Spectral Sensitivity
20431
20432
0.1 0.3 0.5 0.7 0.9
80°
60°
40°
20°
- 20°
- 40°
- 60°
- 80°
TSOP853.., TSOP855..
www.vishay.com
Vishay Semiconductors
Not for New Designs
Rev. 1.9, 07-Nov-13
5
Document Number: 81860
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SUITABLE DATA FORMAT
The TSOP853.. and TSOP855.. series are designed to
suppress spurious output pulses due to noise or disturbance
signals. Data and disturbance signals can be distinguished
by the devices according to carrier frequency, burst length
and envelope duty cycle. The data signal should be close to
the band-pass center frequency (e.g. 38 kHz) and fulfill the
conditions in the table below.
When a data signal is applied to the TSOP853.. and
TSOP855.. series in the presence of a disturbance signal,
the sensitivity of the receiver is reduced to insure that no
spurious pulses are present at the output. Some examples
of disturbance signals which are suppressed are:
DC light (e.g. from tungsten bulb or sunlight)
Continuous signals at any frequency
• Modulated noise from fluorescent lamps with electronic
ballasts
Fig. 13 - IR Signal from Fluorescent Lamp
with Low Modulation
Fig. 14 - IR Signal from Fluorescent Lamp
with High Modulation
Notes
For data formats with long bursts (more than 10 carrier cycles) please see the datasheet for TSOP852.., TSOP854..
Example of compatible products for IR-codes:
- TSOP85336: MCIR, RCMM
- TSOP85338: Mitsubishi, RECS-80 Code, r-map, XMP-1, XMP-2
- TSOP85356: Mitsubishi, RECS-80 Code, r-map
TSOP853.. TSOP855..
Minimum burst length 6 cycles/burst 6 cycles/burst
After each burst of length
a minimum gap time is required of
6 to 35 cycles
10 cycles
6 to 24 cycles
10 cycles
For bursts greater than
a minimum gap time in the data stream is needed of
35 cycles
> 6 x burst length
24 cycles
> 25 ms
Maximum number of continuous short
bursts/second
2000 2000
Recommended for NEC code yes yes
Recommended for RC5/RC6 code yes yes
Recommended for RCMM code yes yes
Recommended for r-step code) yes yes
Recommended for XMP code yes yes
Suppression of interference from fluorescent lamps
Even critical disturbance signals are
suppressed (examples: signal pattern of
fig. 13 and fig. 14)
Even critical disturbance signals are
suppressed (examples: signal pattern of
fig. 13 and fig. 14)
TSOP853.., TSOP855..
www.vishay.com
Vishay Semiconductors
Not for New Designs
Rev. 1.9, 07-Nov-13
6
Document Number: 81860
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters
ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Excercise extreme care to keep the
maximum temperature below 260
°C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
Handling after reflow should be done only after the work
surface has been cooled off
Manual Soldering
Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
Finish soldering within 3 s
Handle products only after the temperature has cooled off
(2.2)
(4.9)
1.7 nom. 1.7 nom.
8
1 1
3.3
2.74
Not indicated to lerances ± 0.25
Proposed pad layout from component side
(dim. for reference only)
(0.5)
(0.6)
(5x)
(R1.35)
1.7 nom
1.7 nom
2
0.7
(5x)
(sideview assembly)
(topview assembly)
1.1
0.8
(5x)
1.7
12345
4 x 1.7 = 6.8
1.7
4 x 1.7 = 6.8
optional GND pad
connection not necessary
specications
according to DIN
technical drawings
Drawing-No.: 6.550-5292.01-4
Issue: 3; 19.11.10
20426
Marking area
Pick and Place area
min. 1.5
possible package deviations caused by
tolerances in the manufacturing process
either on pick and place side or solder pad side
min. 1.5
0 - 0.1
(R1.35)
5:1

TSOP85536TR

Mfr. #:
Manufacturer:
Description:
SENSOR REMOTE REC 36.0KHZ 45M
Lifecycle:
New from this manufacturer.
Delivery:
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