BGU7041 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 13 September 2011 3 of 10
NXP Semiconductors
BGU7041
1 GHz wideband low-noise amplifier
5. Limiting values
[1] T
sp
is the temperature at the solder point of the ground lead.
6. Thermal characteristics
7. Characteristics
[1] The fundamental frequency (f
1
) is 1000 MHz. The intermodulation product (IM3) is 2 f
2
f
1
, where
f
2
=f
1
1 MHz. Input power P
i
= 10 dBm.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CC
supply voltage RF input AC coupled 0.6 3.5 V
I
CC(tot)
total supply current configurable with external resistor - 60 mA
P
tot
total power dissipation T
sp
100 C
[1]
- 250 mW
P
i
input power single tone - 10 dBm
T
stg
storage temperature 65 +150 C
T
j
junction temperature - 150 C
T
amb
ambient temperature 10 +70 C
V
ESD
electrostatic discharge
voltage
Human Body Model (HBM);
according to JEDEC standard
22-A114E
2- kV
Charged Device Model (CDM);
according to JEDEC standard
22-C101B
1.5 - kV
Table 6. Thermal characteristics
Symbol Parameter Conditions Typ Unit
R
th(j-sp)
thermal resistance from junction to solder point 240 K/W
Table 7. Characteristics
T
amb
= 25
C; typical values at V
CC
= 3.3 V; Z
S
=Z
L
=75
; R
bias
=7.5
; 40 MHz
f
1
1000 MHz.
Symbol Parameter Conditions Min Typ Max Unit
V
CC
supply voltage RF input AC coupled 3.1 3.3 3.5 V
I
CC(tot)
total supply current - 38 - mA
s
21
2
insertion power gain - 10 dB
SL
sl
slope straight line - 1- dB
FL flatness of frequency response - 0.2 - dB
NF noise figure - 3.8 - dB
RL
in
input return loss - 21 - dB
RL
out
output return loss - 12 - dB
P
L(1dB)
output power at 1 dB gain
compression
1GHz - 12 - dBm
IP3
O
output third-order intercept point
[1]
-29-dBm
