BYQ28X-200,127

BYQ28X-200_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 5 February 2009 3 of 10
NXP Semiconductors
BYQ28X-200
Dual ultrafast rugged rectifier diode
4. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
RRM
repetitive peak reverse
voltage
-200V
V
RWM
crest working reverse
voltage
-200V
V
R
reverse voltage DC - 200 V
I
O(AV)
average output current SQW; δ = 0.5; T
h
92 °C; both diodes conducting;
see Figure 1
; see Figure 2
-10A
I
FRM
repetitive peak forward
current
SQW; δ = 0.5; t
p
= 25 µs; T
h
92 °C; per diode - 10 A
I
FSM
non-repetitive peak
forward current
t
p
= 10 ms; SIN; T
j(init)
= 25 °C; per diode - 50 A
t
p
= 8.3 ms; SIN; T
j(init)
= 25 °C; per diode - 55 A
I
RRM
repetitive peak reverse
current
t
p
=2µs; δ = 0.001 - 0.2 A
I
RSM
non-repetitive peak
reverse current
t
p
= 100 µs - 0.2 A
T
stg
storage temperature -40 150 °C
T
j
junction temperature - 150 °C
Electrostatic discharge
V
ESD
electrostatic discharge
voltage
HBM; C = 250 pF; R = 1.5 k; all pins - 8 kV
Fig 1. Forward power dissipation as a function of
average forward current; square waveform;
maximum values
Fig 2. Forward power dissipation as a function of
average forward current; sinusoidal waveform;
maximum values
I
F(AV)
(A)
08624
001aag976
4
2
6
8
P
tot
(W)
0
δ = 1
0.2
0.1
0.5
001aag977
I
F(AV)
(A)
0642
2
4
6
P
tot
(W)
0
a = 1.57
2.2
2.8
4.0
1.9
BYQ28X-200_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 5 February 2009 4 of 10
NXP Semiconductors
BYQ28X-200
Dual ultrafast rugged rectifier diode
5. Thermal characteristics
6. Isolation characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-h)
thermal resistance from
junction to heatsink
with heatsink compound; see Figure 3 --5.7K/W
R
th(j-a)
thermal resistance from
junction to ambient free
air
-55-K/W
Fig 3. Transient thermal impedance from junction to heatsink as a function of pulse width
003aac898
10
1
10
2
1
10
Z
th(j-h)
(K/W)
10
3
t
p
(s)
10
6
1 1010
1
10
2
10
5
10
3
10
4
t
p
t
p
T
P
t
T
δ =
Table 6. Isolation characteristics
Symbol Parameter Conditions Min Typ Max Unit
V
isol(RMS)
RMS isolation voltage 50 Hz < f < 60 Hz; sinusoidal waveform;
relative humidity < 65 %; clean and dust
free; from all terminals to external heatsink
--2500V
C
isol
isolation capacitance from cathode to external heatsink;
f=1MHz
-10-pF
BYQ28X-200_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 5 February 2009 5 of 10
NXP Semiconductors
BYQ28X-200
Dual ultrafast rugged rectifier diode
7. Characteristics
Table 7. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
F
forward voltage I
F
=10A; T
j
=2C - 1.1 1.25 V
I
F
=5A; T
j
= 150 °C; see Figure 4 - 0.8 0.895 V
I
F
=5A; T
j
= 25 °C - 0.95 1.1 V
I
R
reverse current V
R
=200V; T
j
=2C - 2 10 µA
V
R
=200V; T
j
= 100 °C - 0.1 0.2 mA
Dynamic characteristics
Q
r
recovered charge I
F
=2A; V
R
=30V; dI
F
/dt = 20 A/µs;
T
j
=2C
-49µC
t
rr
reverse recovery time I
F
=1A; V
R
=30V; dI
F
/dt = 100 A/µs;
ramp recovery; T
j
= 25 °C; see Figure 5
-1525ns
I
F
= 0.5 A; I
R
= 1 A; step recovery;
measured at I
R
= 0.25 A; T
j
=2C; see
Figure 6
--20ns
I
RM
peak reverse recovery
current
I
F
=5A; V
R
30 V; dI
F
/dt = 50 A/µs;
T
j
=2C; see Figure 5
-0.50.7A
V
FRM
peak forward recovery
voltage
I
F
=1A; dI
F
/dt = 10 A/µs; T
j
= 25 °C; see
Figure 7
-1-V
Fig 4. Forward current as a function of forward
voltage
Fig 5. Reverse recovery definitions; ramp recovery
001aag978
V
F
(V)
0 1.51.00.5
5
10
15
I
F
(A)
0
(3)(2)(1)
003aac562
t
rr
time
100 %
25 %
I
F
dl
F
dt
I
R
I
RM
Q
r

BYQ28X-200,127

Mfr. #:
Manufacturer:
WeEn Semiconductors
Description:
Rectifiers RECT UFAST 200V
Lifecycle:
New from this manufacturer.
Delivery:
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