SI2302CDS-T1-GE3

Vishay Siliconix
Si2302CDS
Document Number: 68645
S12-2336-Rev. D, 01-Oct-12
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.comm
N-Channel 20 V (D-S) MOSFET
FEATURES
TrenchFET
®
Power MOSFET
Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
Load Switching for Portable Devices
DC/DC Converter
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. Pulse width limited by maximum junction temperature.
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
()I
D
(A) Q
g
(Typ.)
20
0.057 at V
GS
= 4.5 V
2.9
3.5
0.075 at V
GS
= 2.5 V
2.6
Ordering Information: Si2302CDS-T1-E3 (Lead (Pb)-free)
Si2302CDS-T1-GE3 (Lead (Pb)-free and Halogen-free)
* Marking Code
Si2302CDS (N2)*
G
S
D
Top View
2
3
TO-236
(SOT-23)
1
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
Parameter Symbol 5 s Steady State Unit
Drain-Source Voltage
V
DS
20
V
Gate-Source Voltage
V
GS
± 8
Continuous Drain Current (T
J
= 150 °C)
a
T
A
= 25 °C
I
D
2.9 2.6
A
T
A
= 70 °C
2.3 2.1
Pulsed Drain Current
b
I
DM
10
Continuous Source Current (Diode Conduction)
a
I
S
0.72 0.6
Power Dissipation
a
T
A
= 25 °C
P
D
0.86 0.71
W
T
A
= 70 °C
0.55 0.46
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150 °C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
a
t 5 s
R
thJA
120 145
°C/W
Steady State 140 175
Maximum Junction-to-Foot Steady State
R
thJF
62 78
www.vishay.com
2
Document Number: 68645
S12-2336-Rev. D, 01-Oct-12
Vishay Siliconix
Si2302CDS
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.comm
Notes:
a. Pulse test: Pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
SPECIFICATIONS (T
A
= 25 °C, unless otherwise noted)
Parameter Symbol Test Conditions
Limits
Unit
Min. Typ. Max.
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= 250 µA
20
V
Gate-Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
0.40 0.85
Gate-Body Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 8 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 20 V, V
GS
= 0 V
0.1
µA
V
DS
= 20 V, V
GS
= 0 V, T
J
= 50 °C
4
V
DS
= 20 V, V
GS
= 0 V, T
J
= 70 °C
15
On-State Drain Current
a
I
D(on)
V
DS
10 V, V
GS
= 4.5 V
6A
Drain-Source On-Resistance
a
R
DS(on)
V
GS
= 4.5 V, I
D
= 3.6 A
0.045 0.057
V
GS
= 2.5 V, I
D
= 3.1 A
0.056 0.075
Forward Transconductance
a
g
fs
V
DS
= 5 V, I
D
= 3.6 A
13 S
Diode Forward Voltage
V
SD
I
S
= 0.95 A, V
GS
= 0 V
0.7 1.2 V
Dynamic
b
Total Gate Charge
Q
g
V
DS
= 10 V, V
GS
= 4.5 V, I
D
= 3.6 A
3.5 5.5
nCGate-Source Charge
Q
gs
0.6
Gate-Drain Charge
Q
gd
0.45
Gate Resistance
R
g
f = 1 MHz 2 4 8
Switching
Tur n - O n D e l ay Time
t
d(on)
V
DD
= 10 V, R
L
= 2.78
I
D
3.6 A, V
GEN
= 4.5 V, R
g
= 1
815
ns
Rise Time
t
r
715
Turn-Off Delay Time
t
d(off)
30 45
Fall Time
t
f
715
Source-Drain Reverse Recovery Time
t
rr
I
F
= 3.6 A, dI/dt = 100 A/µs
8.5 15
Body Diode Reverse Recovery Charge
Q
rr
24nC
Output Characteristics
0
2
4
6
8
10
0.0 0.5 1.0 1.5 2.0
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
V
GS
=5V thru 2 V
V
GS
=1V
V
GS
=1.5V
Transfer Characteristics
0
2
4
6
8
10
0.0 0.4 0.8 1.2 1.6 2.0
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
T
C
= 25 °C
T
C
= 125 °C
T
C
= - 55 °C
Document Number: 68645
S12-2336-Rev. D, 01-Oct-12
www.vishay.com
3
Vishay Siliconix
Si2302CDS
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.comm
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0.0
0.4
0.8
1.2
1.6
2.0
0.0 0.3 0.6 0.9 1.2 1.5
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
T
C
= 25 °C
T
C
= 125 °C
T
C
= - 55 °C
0
80
160
240
320
400
0 5 10 15 20
C
iss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
C
oss
C
rss
0.6
0.8
1.0
1.2
1.4
1.6
- 50 - 25 0 25 50 75 100 125 150
T
J
-Junction Temperature (°C)
(Normalized)
- On-Resistance
R
DS(on)
V
GS
=2.5V,I
D
=3.1A
V
GS
=4.5V,I
D
=3.6A
On-Resistance vs. Drain Current
Gate Charge
Source-Drain Diode Forward Voltage
0.03
0.04
0.05
0.06
0.07
02468 10
- On-Resistance (Ω)R
DS(on)
I
D
- Drain Current (A)
V
GS
=2.5V
V
GS
=4.5V
I
D
=3.6A
0
1
2
3
4
5
01234
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
V
DS
= 15 V
V
DS
=10V
V
DS
= 5 V
0.0 0.2 0.4 0.6 0.8 1.0 1.2
V
SD
-Source-to-Drain Voltage (V)
- Source Current (A)I
S
1
0.01
0.001
0.1
10
100
T
J
= 25 °C
T
J
= 150 °C
T
J
= - 55 °C

SI2302CDS-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 20V Vds 8V Vgs SOT-23
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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